Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-UPPI1020GM-A-470EK | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Accessories | |
| Series | UPPI | |
| Accessory Type | Processor Module | |
| For Use With/Related Products | Unified Development Platform (UDP) Boards | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | UPPI1020GM-A-470EK | |
| Related Links | UPPI1020G, UPPI1020GM-A-470EK Datasheet, Silicon Labs Distributor | |
![]() | YC122-JR-07680RL | RES ARRAY 2 RES 680 OHM 0404 | datasheet.pdf | |
![]() | FTE-173-01-G-DH | CONN HEADR 146PS .8MM DL R/A SMD | datasheet.pdf | |
![]() | RBM25DTBD-S189 | CONN EDGECARD 50POS R/A .156 SLD | datasheet.pdf | |
![]() | 4201-001LF | FILTER EMI 1500 PF PI TYPE | datasheet.pdf | |
![]() | 1-1105300-2 | CONN PIN 20AWG GOLD | datasheet.pdf | |
| 0404415 | SUPPORT INSULATING MATERIAL | datasheet.pdf | ||
![]() | GMA.3B.070.DA | BEND RELIEF 7.0MM BLUE | datasheet.pdf | |
![]() | CL-30A | ICL 2.5 OHM 25% 8A 19.56MM | datasheet.pdf | |
![]() | ATS-09C-118-C2-R0 | HEATSINK 45X45X15MM XCUT T766 | datasheet.pdf | |
![]() | R46KR422040M2M | CAP FILM 2.2UF 20% 560VDC RADIAL | datasheet.pdf | |
![]() | BFC238564103 | CAP FILM 0.01 UF 5 % 2KVDC RAD | datasheet.pdf | |
![]() | BFC246959122 | CAP FILM 1.2NF 5% 400VDC RAD | datasheet.pdf |