Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-VI30150CHM3/4W | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 50 | |
| Category | Discrete Semiconductor Products | |
| Family | Diodes, Rectifiers - Arrays | |
| Series | TMBS® | |
| Packaging | * | |
| Diode Configuration | 1 Pair Common Cathode | |
| Diode Type | Schottky | |
| Voltage - DC Reverse (Vr) (Max) | 150V | |
| Current - Average Rectified (Io) (per Diode) | 15A | |
| Voltage - Forward (Vf) (Max) @ If | 1.36V @ 15A | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Reverse Recovery Time (trr) | - | |
| Current - Reverse Leakage @ Vr | 200µA @ 150V | |
| Mounting Type | * | |
| Package / Case | * | |
| Supplier Device Package | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | VI30150CHM3/4W | |
| Related Links | VI30150, VI30150CHM3/4W Datasheet, Vishay Semiconductor/Diodes Division Distributor | |
![]() | RR1220Q-220-D | RES SMD 22 OHM 0.5% 1/10W 0805 | datasheet.pdf | |
![]() | CRCW25121K37FKEG | RES SMD 1.37K OHM 1% 1W 2512 | datasheet.pdf | |
![]() | 7140LA25PF8 | IC SRAM 8KBIT 25NS 64TQFP | datasheet.pdf | |
![]() | MS27474E22B2PC | CONN RCPT 85POS JAM NUT W/PINS | datasheet.pdf | |
![]() | CA3106F16S-5SB15 | CONN PLUG 3POS INLINE W/SKTS | datasheet.pdf | |
![]() | A54SX16A-FG144I | IC FPGA 111 I/O 144FBGA | datasheet.pdf | |
![]() | DSC1001AE1-016.6667 | OSC MEMS 16.6667MHZ CMOS SMD | datasheet.pdf | |
![]() | 7V-25.000MAKV-T | Crystal 25.0000MHz 30ppm 8pF 60 Ohm -40°C - 125°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
![]() | ATT-0333-05-SMA-02 | ATTENUATOR 5 DB DC 18GHZ | datasheet.pdf | |
![]() | SPXI020.T | 1500 VDC 20 AMP PHOTOVOLTAIC FUS | datasheet.pdf | |
![]() | TVP00DT-9-35HB | TV 6C 6#22D PIN RECP | datasheet.pdf | |
![]() | LDB311G8005C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |