Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W631GG8KB-11 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 242 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | DDR3 SDRAM | |
| Memory Size | 1G (128M x 8) | |
| Speed | 933MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 78-TFBGA | |
| Supplier Device Package | 78-WBGA (10.5x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W631GG8KB-11 | |
| Related Links | W631GG, W631GG8KB-11 Datasheet, Winbond Electronics Corp. Distributor | |
![]() | 2502-3-01-44-00-00-07-0 | CONN PC PIN CIRC 0.125DIA SILVER | datasheet.pdf | |
![]() | X9C503SIZT1 | IC POT DGTL CTRL 50K OHM 8-SOIC | datasheet.pdf | |
![]() | DCK-3R3D204T614 | CAP 200MF -20% +80% 3.3V SMD | datasheet.pdf | |
![]() | MAX8559ETAGG+T | IC REG LDO 3V 0.3A 8TDFN | datasheet.pdf | |
![]() | EXB-38V161JV | RES ARRAY 4 RES 160 OHM 1206 | datasheet.pdf | |
![]() | 89HPES24N3AZCBXG | IC PCI SW 24LANE 3PORT 420-SBGA | datasheet.pdf | |
![]() | RLB0812-152KL | FIXED IND 1.5MH 100MA 6 OHM TH | datasheet.pdf | |
![]() | 0009522128 | Connector Receptacle, Bottom Entry 12 Position 0.156" (3.96mm) Tin Through Hole | datasheet.pdf | |
![]() | RNC55H9760FSBSL | RES 976 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | RN55C30R5BRE6 | RES 30.5 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | TCBN-T2-M3-8-52 | BRD SPT SNAP LOCK SCREW MNT 52MM | datasheet.pdf | |
![]() | SIT9002AI-38H25ST | OSC MEMS PROG | datasheet.pdf |