Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-W632GG8KB-15 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 242 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | DDR3 SDRAM | |
Memory Size | 2G (256M x 8) | |
Speed | 667MHz | |
Interface | Parallel | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 78-TFBGA | |
Supplier Device Package | 78-WBGA (10.5x8) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | W632GG8KB-15 | |
Related Links | W632GG, W632GG8KB-15 Datasheet, Winbond Electronics Corp. Distributor |
![]() | EXB-A10P273J | RES ARRAY 8 RES 27K OHM 2512 | datasheet.pdf | |
![]() | 574SX1M48S103SD | POT 10K OHM 1/2W PLASTIC LINEAR | datasheet.pdf | |
![]() | EEC28DRXS | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
![]() | 615653B00170G | ALUM EXTRUSION HEAT SINK BLACK . | datasheet.pdf | |
![]() | MMA02040C4707JB300 | RES SMD 0.47 OHM 5% 0.4W 0204 | datasheet.pdf | |
![]() | Y16242K50000T0R | RES SMD 2.5K OHM 0.01% 1/5W 0805 | datasheet.pdf | |
![]() | ATS-15B-175-C2-R0 | HEATSINK 35X35X10MM R-TAB T766 | datasheet.pdf | |
![]() | TJ02515600J0G | 508 TB PLU PLU UP/SIDE | datasheet.pdf | |
![]() | UPJ1HR47MDD1TA | CAP ALUM 0.47UF 20% 50V RADIAL | datasheet.pdf | |
![]() | 70156-3636 | SYSTEM | datasheet.pdf | |
![]() | 7447669012 | FIXED IND 1.2UH 1.8A 105 MOHM | datasheet.pdf | |
![]() | NCP18XQ681J0SRB | Capacitors Inductors Filters... | datasheet.pdf |