Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W947D2HBJX6E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 240 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | Mobile LPDDR SDRAM | |
| Memory Size | 128M (4M x 32) | |
| Speed | 166MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -25°C ~ 85°C | |
| Package / Case | 90-TFBGA | |
| Supplier Device Package | 90-VFBGA (8x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W947D2HBJX6E | |
| Related Links | W947D2, W947D2HBJX6E Datasheet, Winbond Electronics Corp. Distributor | |
![]() | LM3302D | IC QUAD DIFF COMPARATOR 14-SOIC | datasheet.pdf | |
![]() | 2534-44K | FIXED IND 6.8MH 61MA 45 OHM TH | datasheet.pdf | |
![]() | EP1SGX10DF672I6N | IC FPGA 362 I/O 672FBGA | datasheet.pdf | |
![]() | RBM18DRYN | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
![]() | ATMEGA164PA-MCHR | IC MCU 8BIT 16KB FLASH 44QFN | datasheet.pdf | |
![]() | VI-B1L-IY-F2 | CONVERTER MOD DC/DC 28V 50W | datasheet.pdf | |
| 502LBB-ADAG | OSC PROG 1.8V 1.3NS 30PPM 2X2.5 | datasheet.pdf | ||
![]() | APA600-CQ208M | IC FPGA 158 I/O 208CQFP | datasheet.pdf | |
![]() | CA3101E18-11PBA232 | CONN RCPT 5POS INLINE PIN | datasheet.pdf | |
![]() | MENB1030A1202N01 | AC/DC DESKTOP ADAPTER 12V 30W | datasheet.pdf | |
![]() | CTV07RW-15-18HC | CTV 18C 18#20 PIN J/N RECP | datasheet.pdf | |
![]() | BACC45FM14-3PH | 26500 3C 2#16 1#2 P TH RECP LC | datasheet.pdf |