Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W947D6HBHX5I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 312 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | Mobile LPDDR SDRAM | |
| Memory Size | 128M (8M x 16) | |
| Speed | 200MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 60-TFBGA | |
| Supplier Device Package | 60-VFBGA (8x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W947D6HBHX5I | |
| Related Links | W947D6, W947D6HBHX5I Datasheet, Winbond Electronics Corp. Distributor | |
![]() | PT6604E | DC/DC CONVERTER 3.6V 25W | datasheet.pdf | |
![]() | 6643435-1 | ICCON,PIN,ASSY | datasheet.pdf | |
![]() | A15973-20 | TFLEX 3200TG 9X9" | datasheet.pdf | |
![]() | 613010143121 | Connector Header 10 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
![]() | 0218.800MXBP | FUSE GLASS 800MA 250VAC 5X20MM | datasheet.pdf | |
![]() | EEU-EB1J101BJ | CAP ALUM 100UF 20% 63V RADIAL | datasheet.pdf | |
![]() | LM3S1F11-IBZ80-A2T | IC MCU 32BIT 384KB FLASH 108BGA | datasheet.pdf | |
![]() | FCE17E09PN4D0 | D-Sub Connector Plug, Male Pins 9 Position Through Hole Solder | datasheet.pdf | |
![]() | MTCPQKT2P26SFCA | I/O CONN | datasheet.pdf | |
![]() | TVS06RK-15-19PB | TV 19C 19#20 PIN PLUG | datasheet.pdf | |
![]() | 36D172G075AB2A | 1700UF 75V 35X79 85C ST | datasheet.pdf | |
![]() | AIT2-20-19PC | ER 3C 3#8 PIN RECP | datasheet.pdf |