Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-W97BH2KBQX2E | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 168 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | Mobile LPDDR2 SDRAM | |
Memory Size | 2G (64M x 32) | |
Speed | 400MHz | |
Interface | Parallel | |
Voltage - Supply | 1.14 V ~ 1.95 V | |
Operating Temperature | -25°C ~ 85°C | |
Package / Case | 168-WFBGA | |
Supplier Device Package | 168-WFBGA (12x12) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | W97BH2KBQX2E | |
Related Links | W97BH2, W97BH2KBQX2E Datasheet, Winbond Electronics Corp. Distributor |
![]() | 177-025-210-S71 | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | MIC5216-3.2YMM-TR | IC REG LDO 3.2V 0.5A 8MSOP | datasheet.pdf | |
![]() | 172890-4 | CONN AMP-IN CRIMP 4POS NATURAL | datasheet.pdf | |
![]() | 1676625-3 | RES CHAS MNT 270 OHM 5% 25W | datasheet.pdf | |
![]() | TSW-150-21-G-D | CONN HEADER 100POS .100" DBL | datasheet.pdf | |
![]() | SFS-550-CI-BK | CARD GUIDE SNAP COND 5.5"L BLK | datasheet.pdf | |
![]() | RN65C1071DRE6 | RES 1.07K OHM 1/2W .5% AXIAL | datasheet.pdf | |
![]() | 0191930315 | RING VERSAKRIMP (G-376-56) | datasheet.pdf | |
![]() | 88978-001LF | METRAL CONNECTOR | datasheet.pdf | |
![]() | 416F380XXALT | CRYSTAL 38.000 MHZ 12PF SMT | datasheet.pdf | |
![]() | 2M804-001-06ZNU6-4PA | M804 4C 4#23 PIN PLUG OM | datasheet.pdf | |
![]() | CN1021A10G20PN-000 | 26500 2C 2#16 P BY RECP LC | datasheet.pdf |