Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-W9825G2JB-75 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 240 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | SDRAM | |
Memory Size | 256M (8M x 32) | |
Speed | 133MHz | |
Interface | Parallel | |
Voltage - Supply | 2.7 V ~ 3.6 V | |
Operating Temperature | 0°C ~ 70°C | |
Package / Case | 90-TFBGA | |
Supplier Device Package | 90-TFBGA (8x13) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | W9825G2JB-75 | |
Related Links | W9825G, W9825G2JB-75 Datasheet, Winbond Electronics Corp. Distributor |
![]() | EEV-FC1C101P | CAP ALUM 100UF 20% 16V SMD | datasheet.pdf | |
![]() | TSM101AID | IC CTRLR VOLTAGE/CURRENT 8-SOIC | datasheet.pdf | |
![]() | RBC13DCAN | CONN EDGECARD 26POS R/A .100 EXT | datasheet.pdf | |
![]() | RCM18DSAI | CONN EDGECARD 36POS R/A .156 SLD | datasheet.pdf | |
![]() | 964274-2 | MICRO TIM2 CONTACT | datasheet.pdf | |
![]() | VI-B3X-IU-B1 | CONVERTER MOD DC/DC 5.2V 200W | datasheet.pdf | |
![]() | 501PAL-ABAG | OSC PROG 8NS 50PPM 3.2X5MM | datasheet.pdf | |
![]() | 950302 | TBF/P THUMB GRIP FOR LID SCR | datasheet.pdf | |
![]() | ABC06DRSZ-S664 | CONN EDGECARD 12POS .100" | datasheet.pdf | |
![]() | ATS-12B-76-C1-R0 | HEATSINK 25X25X25MM R-TAB | datasheet.pdf | |
![]() | MS27466T17F35S-UTHST3 | CONN RCPT 66POS FLANGE W/SKT | datasheet.pdf | |
![]() | XCV300E-5BG432I | IC FPGA 260 I/O 352MBGA | datasheet.pdf |