Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-W987D2HBJX6E | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 240 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | Mobile LPSDR SDRAM | |
Memory Size | 128M (4M x 32) | |
Speed | 166MHz | |
Interface | Parallel | |
Voltage - Supply | 1.7 V ~ 1.95 V | |
Operating Temperature | -25°C ~ 85°C | |
Package / Case | 90-TFBGA | |
Supplier Device Package | 90-VFBGA (8x13) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | W987D2HBJX6E | |
Related Links | W987D2, W987D2HBJX6E Datasheet, Winbond Electronics Corp. Distributor |
![]() | RMC65DRTS-S734 | CONN EDGECARD 130PS DIP .100 SLD | datasheet.pdf | |
![]() | MIC2006-1.2YM6TX | IC DISTRIBUTION SW 1.2A SOT23-6 | datasheet.pdf | |
![]() | S4-0R05F1 | RES SMD 0.05 OHM 1% 2W 4525 | datasheet.pdf | |
![]() | R8A77230C400BG | IC MCU 32BIT ROMLESS 449FBGA | datasheet.pdf | |
![]() | R2S8-1212/P | CONV DC/DC 2W 12VIN 12VOUT SMD | datasheet.pdf | |
![]() | VE-2TP-MW-F3 | CONVERTER MOD DC/DC 13.8V 100W | datasheet.pdf | |
![]() | 1455D802BK | BOX ALUM BLACK 3.15"L X 1.67"W | datasheet.pdf | |
![]() | 0387101409 | Connector Barrier Block Strip 9 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | JR16WCCA-12(72) | CONN STRAIN RELIEF JR16 12MM | datasheet.pdf | |
![]() | L17TF1512104 | D-Sub Connector Plug, Male Pins 15 Position Through Hole Press-Fit | datasheet.pdf | |
![]() | A17130-05 | TGON 9100 100UM 180X220MM | datasheet.pdf | |
![]() | XC7V585T-1LFFG784E | Field Programmable Gate Array, 91050 CLBs, PBGA784 IC | datasheet.pdf |