Xilinx XC17S05XLVOG8I
- Mfg. Part Number
- XC17S05XLVOG8I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Memory Circuit, 54544X1, CMOS, PDSO8 IC
- Datasheet Download
- XC17S05XLVOG8I.pdf
Availability of XC17S05XLVOG8I
Available Quantity
8710 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC17S05XLVOG8I, we specialize in Xilinx all series electronic components. XC17S05XLVOG8I can be shipped within 24 hours after order. If you have any demands for XC17S05XLVOG8I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC17S05XLVOG8I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC17S05XLVOG8I
| Internal Part Number | EIS-XC17S05XLVOG8I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC17S05XLVOG8I today | |
| Series | XC17S05 | |
| Lifecycle status | Discontinued | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.32.00.71 | |
| Number of CLBs | - | |
| Number of Terminals | 8 | |
| Technology | CMOS | |
| Feature | 54544X1 | |
| Package Code | TSOP2 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE Meter | |
| Surface Mount | YES | |
| Width | 3.9 mm | |
| Length | 4.9 mm | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | XC17S05XLVO8C-1437682557,XC17S05XLVO8I-1437682560,XC17S05XLVOG8C-2025412077 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC17S05XLVOG8I | |
| Alternative Part (Replacement) | EIS-XC17S05XLVOG8I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC17S05, XC17S05XLVOG8I Datasheet, Xilinx Distributor | |
XC17S05XLVOG8I Details Description
Related parts for XC17S05XLVOG8I
 | DP-241-7-120 | XFRMR LAMINATED 56VA CHAS MOUNT | datasheet.pdf | |
 | CRCW25124K99FKTG | RES SMD 4.99K OHM 1% 1W 2512 | datasheet.pdf | |
 | RCC49DRYH-S93 | CONN EDGECARD 98POS DIP .100 SLD | datasheet.pdf | |
.jpg) | RTS-053.3/P-R | CONV DC/DC 2W 05VIN 3.3VOUT | datasheet.pdf | |
| VI-B2L-IX-F3 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
| 0838 000 X5F0 121 KLF | CAP CER 120PF X5F RADIAL | datasheet.pdf | |
| 0387100223 | Connector Barrier Block Strip 23 Circuit 0.375" (9.53mm) | datasheet.pdf | |
| ACC61DTBN-S664 | CONN EDGECARD 122POS .100" | datasheet.pdf | |
 | AT24C16D-PUM | IC EEPROM 16KBIT 1MHZ 8DIP | datasheet.pdf | |
| 1-172186-6 | MTEI CONN. 16P REC. ASSY | datasheet.pdf | |
| BFC2370GB562 | CAP FILM 5600PF 10% 630VDC RDL | datasheet.pdf | |
| XCV150-6BCG352C | IC FPGA 180 I/O 256BGA | datasheet.pdf |