Xilinx XC17S30APDG8C
- Mfg. Part Number
- XC17S30APDG8C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Configuration Memory, 336768X1, Serial, CMOS, PDIP8 IC
- Datasheet Download
- XC17S30APDG8C.pdf
Availability of XC17S30APDG8C
Available Quantity
14650 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC17S30APDG8C, we specialize in Xilinx all series electronic components. XC17S30APDG8C can be shipped within 24 hours after order. If you have any demands for XC17S30APDG8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC17S30APDG8C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC17S30APDG8C
| Internal Part Number | EIS-XC17S30APDG8C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC17S30APDG8C today | |
| Series | XC17S30 | |
| Lifecycle status | Discontinued | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.32.00.51 | |
| Number of CLBs | - | |
| Number of Terminals | 8 | |
| Technology | CMOS | |
| Feature | 336768X1 | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE Meter | |
| Surface Mount | NO | |
| Width | 7.62 mm | |
| Length | 9.3599 mm | |
| Moisture Sensitivity Level | 1 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | XC17S30APD8C-1533381071,XC17S30APD8I-1533381072,XC17S30APDG8I-2040291833 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC17S30APDG8C | |
| Alternative Part (Replacement) | EIS-XC17S30APDG8C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC17S3, XC17S30APDG8C Datasheet, Xilinx Distributor | |
XC17S30APDG8C Details Description
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