Xilinx XC17S30AVOG8I

XC17S30AVOG8I picture photo
Mfg. Part Number
XC17S30AVOG8I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Configuration Memory, 336768X1, Serial, CMOS, PDSO8 IC
Datasheet Download
XC17S30AVOG8I.pdf
Availability of XC17S30AVOG8I

Available Quantity

6370 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XC17S30AVOG8I, we specialize in Xilinx all series electronic components. XC17S30AVOG8I can be shipped within 24 hours after order. If you have any demands for XC17S30AVOG8I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC17S30AVOG8I Order Process
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Specifications of XC17S30AVOG8I
Internal Part NumberEIS-XC17S30AVOG8I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S30AVOG8I today
SeriesXC17S30
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.51
Number of CLBs-
Number of Terminals8
TechnologyCMOS
Feature336768X1
Package CodeTSOP2
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE Meter
Surface MountYES
Width3.9 mm
Length4.9 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)260
Combinatorial Delay of a CLB-Max-
alternatesXC17S30AVO8C-1533381075,XC17S30AVO8I-1533381076,XC17S30AVOG8C-2025412009
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S30AVOG8I
Alternative Part (Replacement)EIS-XC17S30AVOG8I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC17S3, XC17S30AVOG8I Datasheet, Xilinx Distributor
XC17S30AVOG8I Details Description
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