Xilinx XC17S30PDG8I
- Mfg. Part Number
- XC17S30PDG8I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Memory Circuit, 247968X1, CMOS, PDIP8 IC
- Datasheet Download
- XC17S30PDG8I.pdf
Availability of XC17S30PDG8I
Available Quantity
13130 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC17S30PDG8I, we specialize in Xilinx all series electronic components. XC17S30PDG8I can be shipped within 24 hours after order. If you have any demands for XC17S30PDG8I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC17S30PDG8I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC17S30PDG8I
| Internal Part Number | EIS-XC17S30PDG8I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC17S30PDG8I today | |
| Series | XC17S3 | |
| Lifecycle status | Discontinued | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.32.00.71 | |
| Number of CLBs | - | |
| Number of Terminals | 8 | |
| Technology | CMOS | |
| Feature | 247968X1 | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE Meter | |
| Surface Mount | NO | |
| Width | 7.62 mm | |
| Length | 9.3599 mm | |
| Moisture Sensitivity Level | 1 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | XC17S30PD8C-1437682434,XC17S30PD8I-1437682437,XC17S30PDG8C-2040291842 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC17S30PDG8I | |
| Alternative Part (Replacement) | EIS-XC17S30PDG8I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC17S3, XC17S30PDG8I Datasheet, Xilinx Distributor | |
XC17S30PDG8I Details Description
Related parts for XC17S30PDG8I
 | MR-3501 | CONN 3.5MM FEMALE MONO JACK | datasheet.pdf | |
 | C300K4R0E | RES CHAS MNT 4 OHM 10% 300W | datasheet.pdf | |
 | 152885 | CONN RING STR 18-16AWG M3.5 TIN | datasheet.pdf | |
 | FQD10N20CTM_F080 | MOSFET N-CH 200V 7.8A DPAK | datasheet.pdf | |
| 1-282815-6 | TERM BLOCK HDR 16POS R/A 5.08MM | datasheet.pdf | |
| 316874-4 | CONN PLUG HSG 25POS SOCKET | datasheet.pdf | |
 | 0215002.MXESPP | FUSE CERAMIC 2A 250VAC 5X20MM | datasheet.pdf | |
 | R2S12-153.3 | CONV DC/DC 2W 15VIN 3.3VOUT SMD | datasheet.pdf | |
 | H16WD6090G-10 | RELAY SSR 90A 660VAC RAND DC IN | datasheet.pdf | |
| 160R-421JS | FIXED IND 430NH 860MA 170 MOHM | datasheet.pdf | |
| ATS-21H-171-C1-R0 | HEATSINK 30X30X20MM R-TAB | datasheet.pdf | |
 | ATS-MG210-R0 | MAXIGRIP CLIP KIT 21X21MM | datasheet.pdf |