Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC2S50-5FG256I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Assembly Site Addition 01/Jun/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan®-II | |
| Number of LABs/CLBs | 384 | |
| Number of Logic Elements/Cells | 1728 | |
| Total RAM Bits | 32768 | |
| Number of I/O | 176 | |
| Number of Gates | 50000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC2S50-5FG256I | |
| Related Links | XC2S50-, XC2S50-5FG256I Datasheet, Xilinx Distributor | |
![]() | TW-E40-1020 | BREADBOARD 2.13x6.496 SLDLESS | datasheet.pdf | |
![]() | RMM10DRTF | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
![]() | GEM18DRSN-S288 | CONN EDGECARD 36POS .156 EXTEND | datasheet.pdf | |
![]() | NTMFS4851NT3G | MOSFET N-CH 30V 9.5A SO-8FL | datasheet.pdf | |
![]() | 3048085 | FML TEST CONNECTOR 5MM 1POS GRAY | datasheet.pdf | |
![]() | VE-B2T-CY-F2 | CONVERTER MOD DC/DC 6.5V 50W | datasheet.pdf | |
![]() | VI-B7N-EY-F1 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
![]() | M50-4304445 | 44+44 DIL SMT VERT SOCKET | datasheet.pdf | |
![]() | 1210-3S-230 | SPD AC 3W+G 230VAC | datasheet.pdf | |
| TLZ27D-GS08 | DIODE ZENER 27V 500MW SOD80 | datasheet.pdf | ||
![]() | EL731-04-00 | AC/DC EARTH-LKGE RELAY | datasheet.pdf | |
![]() | D38999/24JB98BA | CONN RCPT 6POS JAM NUT W/SKT | datasheet.pdf |