Xilinx XC2VP30-6FG676C

XC2VP30-6FG676C picture photo
Mfg. Part Number
XC2VP30-6FG676C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array, 3424 CLBs, 1200MHz, 30816-Cell, CMOS, PBGA676 IC
Datasheet Download
XC2VP30-6FG676C.pdf
Availability of XC2VP30-6FG676C

Available Quantity

11160 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of XC2VP30-6FG676C, we specialize in Xilinx all series electronic components. XC2VP30-6FG676C can be shipped within 24 hours after order. If you have any demands for XC2VP30-6FG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC2VP30-6FG676C Order Process
Add Parts to RFQ form
Submit RFQ
We reply within 24 hours
You confirm order
Payment
Ship out your order
Specifications of XC2VP30-6FG676C
Internal Part NumberEIS-XC2VP30-6FG676C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC2VP30-6FG676C today
SeriesXC2VP30-
Lifecycle statusDiscontinued
RoHS StatusContact us
HTS Code8542.39.00.01
Number of CLBs3424
Number of Terminals676
TechnologyCMOS
Feature3424 CLBS
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width27 mm
Length27 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)225
Combinatorial Delay of a CLB-Max0.32 ns
alternatesXC2VP30-6FG676I-1978195231,XC2VP30-6FGG676C-2025411781,XC2VP30-6FGG676I-2025411784
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC2VP30-6FG676C
Alternative Part (Replacement)EIS-XC2VP30-6FG676C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC2VP30, XC2VP30-6FG676C Datasheet, Xilinx Distributor
XC2VP30-6FG676C Details Description
Related parts for XC2VP30-6FG676C
HEATSINK EXTRUDED 25X41.6X38.1MM datasheet.pdf
OSC MEMS 20.000MHZ CMOS SMD datasheet.pdf
IC PMIC 2CEL LI+ 6CH 48TQFN datasheet.pdf
CONN TERM BLOCK 12-18AWG GRAY datasheet.pdf
RES ARRAY 7 RES 68K OHM 14SOIC datasheet.pdf
RES 52.3K OHM 1/8W .5% AXIAL datasheet.pdf
CONN HDR 72POS 2.54MM T/H datasheet.pdf
HEADER BERGSTIK datasheet.pdf
HEATSINK 60X60X25MM XCUT datasheet.pdf
RES SMD 210 OHM 1W 1206 WIDE datasheet.pdf
FIXED IND 10UH 1.8A 199 MOHM SMD datasheet.pdf
DIODE ZENER 15V 350MW SOT23 datasheet.pdf