Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC2VP4-5FGG456I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex®-II Pro | |
| Number of LABs/CLBs | 752 | |
| Number of Logic Elements/Cells | 6768 | |
| Total RAM Bits | 516096 | |
| Number of I/O | 248 | |
| Number of Gates | - | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 456-BBGA | |
| Supplier Device Package | 456-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC2VP4-5FGG456I | |
| Related Links | XC2VP4-, XC2VP4-5FGG456I Datasheet, Xilinx Distributor | |
![]() | ST32TB100 | TRIMMER 10 OHM 0.125W SMD | datasheet.pdf | |
![]() | SE75PFR-CR0 | SLEEVE EXP FR BLK 0.75" (19.1MM) | datasheet.pdf | |
![]() | STEVAL-CCA023V1 | BOARD EVAL MIC PREAMP FOR TS472 | datasheet.pdf | |
![]() | MAX8776GTJ+T | IC REG BOOST TQFN | datasheet.pdf | |
![]() | CA3106F14S-2PF80F0 | CONN HSG INLINE MNT PLUG 4POS | datasheet.pdf | |
![]() | VE-B5M-IV-F4 | CONVERTER MOD DC/DC 10V 150W | datasheet.pdf | |
![]() | 031802.5VXP | FUSE GLASS 2.5A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | M39003/09-0007 | CAP TANT 270UF 10% 6V AXIAL | datasheet.pdf | |
![]() | 68001-107HLF | BS II SNGL | datasheet.pdf | |
![]() | GBB95DYRT | CONN CARD EXTEND .050" 95POS | datasheet.pdf | |
![]() | ATS-12A-02-C3-R0 | HEATSINK 40X40X12.7MM XCUT T412 | datasheet.pdf | |
![]() | 164A11209X | CONN DSUB 50POS F W/W TIN | datasheet.pdf |