Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC3S1400AN-4FGG484C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Spartan-3AN FPGA Series 02/Sep/2013 | |
PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Spartan®-3AN | |
Number of LABs/CLBs | 2816 | |
Number of Logic Elements/Cells | 25344 | |
Total RAM Bits | 589824 | |
Number of I/O | 372 | |
Number of Gates | 1400000 | |
Voltage - Supply | 1.14 V ~ 1.26 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BBGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC3S1400AN-4FGG484C | |
Related Links | XC3S1400A, XC3S1400AN-4FGG484C Datasheet, Xilinx Distributor |
![]() | VS-85HFR80 | DIODE GEN PURP 800V 85A DO203AB | datasheet.pdf | |
![]() | EGM10DTKT | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
![]() | VSP2560PTR | IC CCD SIGNAL PROC 10BIT 48-LQFP | datasheet.pdf | |
![]() | 4-641207-0 | CONN HEADER 10POS R/A .156 GOLD | datasheet.pdf | |
![]() | 50MM-5M-5515-20 | THERMAL INTERFACE PAD 50MM | datasheet.pdf | |
![]() | VI-27L-IX-F2 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
![]() | 1739279 | TERM BLOCK | datasheet.pdf | |
![]() | ATS-12E-119-C3-R0 | HEATSINK 45X45X20MM XCUT T412 | datasheet.pdf | |
![]() | 10082378-11103TLF | PCIE PRESS FIT | datasheet.pdf | |
![]() | BFC237141124 | CAP FILM 120NF 10% 250VDC RAD | datasheet.pdf | |
![]() | D38999/26ZC35AC | TV 22C 22#22D PIN PLUG | datasheet.pdf | |
![]() | LFSN25N16C2450BAH-947/2450MHZ | Capacitors Inductors Filters... | datasheet.pdf |