Xilinx XC3S200-5FGG1156C
- Mfg. Part Number
- XC3S200-5FGG1156C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA1156 IC
- Datasheet Download
- XC3S200-5FGG1156C.pdf
Availability of XC3S200-5FGG1156C
Available Quantity
6970 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC3S200-5FGG1156C, we specialize in Xilinx all series electronic components. XC3S200-5FGG1156C can be shipped within 24 hours after order. If you have any demands for XC3S200-5FGG1156C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC3S200-5FGG1156C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC3S200-5FGG1156C
| Internal Part Number | EIS-XC3S200-5FGG1156C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC3S200-5FGG1156C today | |
| Series | XC3S200-5 | |
| Lifecycle status | Discontinued | |
| RoHS Status | Contact us | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 192 | |
| Number of Terminals | 1156 | |
| Technology | - | |
| Feature | 192 CLBS, 50000 GATES | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 35 mm | |
| Length | 35 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | - | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC3S200-5FGG1156C | |
| Alternative Part (Replacement) | EIS-XC3S200-5FGG1156C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC3S200-, XC3S200-5FGG1156C Datasheet, Xilinx Distributor | |
XC3S200-5FGG1156C Details Description
Related parts for XC3S200-5FGG1156C
 | DS80C390-QNR | IC MPU CAN DUAL HS IND 68-PLCC | datasheet.pdf | |
 | RBA40DTKT | CONN EDGECARD 80POS DIP .125 SLD | datasheet.pdf | |
| RCM15DRMS | CONN EDGECARD 30POS .156 WW | datasheet.pdf | |
 | 04023J4R1CBWTR | CAP THIN FILM 4.1PF 25V 0402 | datasheet.pdf | |
 | CY62158EV30LL-45BVXI | IC SRAM 8MBIT 45NS 48VFBGA | datasheet.pdf | |
 | VN750S-E | IC DRIVER HIGH SIDE 8-SOIC | datasheet.pdf | |
| VE-B3M-EX-F3 | CONVERTER MOD DC/DC 10V 75W | datasheet.pdf | |
 | RNC50J2433BSBSL | RES 243K OHM 1/10W .1% AXIAL | datasheet.pdf | |
| ATS-04F-169-C3-R0 | HEATSINK 30X30X10MM R-TAB T412 | datasheet.pdf | |
| ATS-01B-178-C2-R0 | HEATSINK 35X35X25MM R-TAB T766 | datasheet.pdf | |
| V515515300J0G | 508 TB PL PL DIN/R WF A | datasheet.pdf | |
| MSG5ARR-1FPFK | MSG 3U RECEPTACLES | datasheet.pdf |