Xilinx XC3S50AN-4FG676C
- Mfg. Part Number
- XC3S50AN-4FG676C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, CMOS, PBGA676 IC
- Datasheet Download
- XC3S50AN-4FG676C.pdf
Availability of XC3S50AN-4FG676C
Available Quantity
11050 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC3S50AN-4FG676C, we specialize in Xilinx all series electronic components. XC3S50AN-4FG676C can be shipped within 24 hours after order. If you have any demands for XC3S50AN-4FG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC3S50AN-4FG676C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC3S50AN-4FG676C
| Internal Part Number | EIS-XC3S50AN-4FG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC3S50AN-4FG676C today | |
| Series | XC3S50AN | |
| Lifecycle status | Active | |
| RoHS Status | Contact us | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 176 | |
| Number of Terminals | 676 | |
| Technology | CMOS | |
| Feature | 176 CLBS, 50000 GATES | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 27 mm | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| alternates | XC3S50AN-4FG676I-2121273641,XC3S50AN-4FGG676C-2121273651,XC3S50AN-4FGG676I-2121273653 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC3S50AN-4FG676C | |
| Alternative Part (Replacement) | EIS-XC3S50AN-4FG676C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC3S50AN, XC3S50AN-4FG676C Datasheet, Xilinx Distributor | |
XC3S50AN-4FG676C Details Description
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