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Xilinx XC3SD3400A-4FGG676C

XC3SD3400A-4FGG676C picture photo
Mfg. Part Number
XC3SD3400A-4FGG676C
Manufacturer
Product Category
Embedded - FPGAs (Field Programmable Gate Array)
Brief Description
IC FPGA 469 I/O 676FBGA
Datasheet Download
XC3SD3400A-4FGG676C.pdf
Availability of XC3SD3400A-4FGG676C

Available Quantity

5060 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 113.75000
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XC3SD3400A-4FGG676C, we specialize in Xilinx all series electronic components. XC3SD3400A-4FGG676C can be shipped within 24 hours after order. If you have any demands for XC3SD3400A-4FGG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC3SD3400A-4FGG676C Order Process
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Specifications of XC3SD3400A-4FGG676C
Internal Part NumberEIS-XC3SD3400A-4FGG676C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Product Training ModulesExtended Spartan 3A FPGA Family
PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013
Copper Wire Bond Material 09/Dec/2013
EDA / CAD ModelsDownload from Accelerated Designs
Standard Package40
Category Integrated Circuits (ICs)
FamilyEmbedded - FPGAs (Field Programmable Gate Array)
SeriesSpartan®-3A DSP
Number of LABs/CLBs5968
Number of Logic Elements/Cells53712
Total RAM Bits2322432
Number of I/O469
Number of Gates3400000
Voltage - Supply1.14 V ~ 1.26 V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)XC3SD3400A-4FGG676C
Related LinksXC3SD3400, XC3SD3400A-4FGG676C Datasheet, Xilinx Distributor
XC3SD3400A-4FGG676C Details Description
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