Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC3SD3400A-5FGG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Extended Spartan 3A FPGA Family | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 Copper Wire Bond Material 09/Dec/2013 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan®-3A DSP | |
| Number of LABs/CLBs | 5968 | |
| Number of Logic Elements/Cells | 53712 | |
| Total RAM Bits | 2322432 | |
| Number of I/O | 469 | |
| Number of Gates | 3400000 | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC3SD3400A-5FGG676C | |
| Related Links | XC3SD3400, XC3SD3400A-5FGG676C Datasheet, Xilinx Distributor | |
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