Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 20 weeks
| Internal Part Number | EIS-XC5210-6PQ208C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | XC1700, 5200, HQ, SCD Families 19/Jul/2010 | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | XC5200 | |
| Number of LABs/CLBs | 324 | |
| Number of Logic Elements/Cells | 1296 | |
| Total RAM Bits | - | |
| Number of I/O | 164 | |
| Number of Gates | 16000 | |
| Voltage - Supply | 4.75 V ~ 5.25 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 208-BFQFP | |
| Supplier Device Package | 208-PQFP (28x28) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC5210-6PQ208C-EIS | |
| Related Links | XC5210-, XC5210-6PQ208C Datasheet, Xilinx Distributor | |
![]() | RCM15DTBS | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | EMM15DRST-S273 | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | 1-1478148-0 | CONN BNC JACK STR 50 OHM SOLDER | datasheet.pdf | |
![]() | CDCE937PWR | IC 3PLL VCXO CLK SYNTH 20-TSSOP | datasheet.pdf | |
![]() | UB5C-82RF8 | RES 82 OHM 5W 1% AXIAL | datasheet.pdf | |
![]() | VE-B12-CV | CONVERTER MOD DC/DC 15V 150W | datasheet.pdf | |
![]() | 0216001.MXGP | FUSE CERAMIC 1A 250VAC 5X20MM | datasheet.pdf | |
![]() | ER1025-30KR | FIXED IND 2.7UH 335MA 550 MOHM | datasheet.pdf | |
![]() | 50YXH470MEFC12.5X20 | CAP ALUM 470UF 20% 50V RADIAL | datasheet.pdf | |
![]() | V72C48T150BS | CONVERTER MOD DC/DC 48V 150W | datasheet.pdf | |
![]() | DF36-20P-0.4SD(55) | CONN PLUG 0.4MM 20POS | datasheet.pdf | |
![]() | ATS-12F-93-C2-R0 | HEATSINK 40X40X20MM R-TAB T766 | datasheet.pdf |