Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX45-N3FGG484C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 3411 | |
| Number of Logic Elements/Cells | 43661 | |
| Total RAM Bits | 2138112 | |
| Number of I/O | 316 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BBGA | |
| Supplier Device Package | 484-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX45-N3FGG484C | |
| Related Links | XC6SLX45-, XC6SLX45-N3FGG484C Datasheet, Xilinx Distributor | |
![]() | 1621470000 | TERM BLOCK HDR 24POS VERT 3.5MM | datasheet.pdf | |
![]() | MAX16903SATB33/V+T | IC REG BUCK 3.3V 1A SYNC 10TDFN | datasheet.pdf | |
![]() | B7AM-8B11 | I/O MODULE 8 DIG 8 SS 12-24VDC | datasheet.pdf | |
![]() | RNC55J1503BSBSL | RES 150K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | XBP24-BPIT-002J | XBEE PRO ZNET 2.5 SER2 10MW PCB | datasheet.pdf | |
![]() | D4N-4C72R | D4N-4C72R | datasheet.pdf | |
![]() | 460-10-206-00-001101 | HEADER SLOTTED 2.54MM | datasheet.pdf | |
![]() | ATS-21E-158-C2-R0 | HEATSINK 40X40X35MM L-TAB T766 | datasheet.pdf | |
![]() | 103-1043-BL-00200 | CBL USB3.0 B/M TO OPEN | datasheet.pdf | |
![]() | CRCW0805470KFKTB | RES SMD 470K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | TV06QDT-25-20SA | TV 30C MIX(QUAD) SKT RECP | datasheet.pdf | |
![]() | B82805A773A250 | P100625 E6.3 SMT PUSH-PULL TRANS | datasheet.pdf |