Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX75-N3FG676I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 5831 | |
| Number of Logic Elements/Cells | 74637 | |
| Total RAM Bits | 3170304 | |
| Number of I/O | 408 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX75-N3FG676I | |
| Related Links | XC6SLX75, XC6SLX75-N3FG676I Datasheet, Xilinx Distributor | |
![]() | RCM28DRYS | CONN EDGECARD 56POS DIP .156 SLD | datasheet.pdf | |
![]() | 160473J400F-F | CAP FILM 0.047UF 5% 400VDC RAD | datasheet.pdf | |
![]() | LM22675MR-5.0/NOPB | IC REG BUCK 5V 1A 8SOPWRPAD | datasheet.pdf | |
![]() | ERA-6AEB7680V | RES SMD 768 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | 9-1879264-5 | RES SMD 133K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | 9-1879221-9 | RES SMD 17.8 OHM 0.1% 1/16W 0603 | datasheet.pdf | |
![]() | VE-261-MV-B1 | CONVERTER MOD DC/DC 12V 150W | datasheet.pdf | |
![]() | RLR20C1431FRRSL | RES 1.43K OHM 1% 1/2W AXIAL | datasheet.pdf | |
![]() | S8JX-G10048 | AC/DC CONVERTER 48V 100W | datasheet.pdf | |
![]() | 09185266329 | CONN HEADER 26POS T/H | datasheet.pdf | |
![]() | MP4423HGQ-Z | IC REG BUCK ADJ 3A SYNC | datasheet.pdf | |
![]() | MS27505E17B26P-LC | LJT 26C 26#20 PIN RECP | datasheet.pdf |