Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX75-N3FGG484I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 5831 | |
| Number of Logic Elements/Cells | 74637 | |
| Total RAM Bits | 3170304 | |
| Number of I/O | 280 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BBGA | |
| Supplier Device Package | 484-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX75-N3FGG484I | |
| Related Links | XC6SLX75-, XC6SLX75-N3FGG484I Datasheet, Xilinx Distributor | |
![]() | 396-2 | TAPE FILM SUPER BOND 2" X 36YD | datasheet.pdf | |
![]() | 1879466-2 | RES CHAS MNT 1.2 OHM 5% 80W | datasheet.pdf | |
![]() | CA06R10SL-4SA152 | CONN PLUG 2POS INLINE W/SKTS | datasheet.pdf | |
![]() | 10112690-G03-04ULF | CONN HEADER 8POS DL HORIZ SMD | datasheet.pdf | |
![]() | VE-JWN-MY-B1 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
![]() | RNR50J8060FSB14 | RES 806 OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | 100ZLH18MEFCT16.3X11 | CAP ALUM 18UF 20% 100V RADIAL | datasheet.pdf | |
![]() | CMF6049K900FHEK | RES 49.9K OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | ESR10EZPF2051 | RES SMD 2.05K OHM 1% 0.4W 0805 | datasheet.pdf | |
![]() | PIC12F1571T-I/MF | IC MCU 8BIT 1.75KB FLASH 8DFN | datasheet.pdf | |
![]() | 59070-3-T-05-D | REED SENSORS | datasheet.pdf | |
![]() | CW01091R00JE12HE | RES 91 OHM 13W 5% AXIAL | datasheet.pdf |