Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6VLX130T-3FF1156C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Substrate Supplier Addition 03/Nov/2014 | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex® 6 LXT | |
| Number of LABs/CLBs | 10000 | |
| Number of Logic Elements/Cells | 128000 | |
| Total RAM Bits | 9732096 | |
| Number of I/O | 600 | |
| Number of Gates | - | |
| Voltage - Supply | 0.95 V ~ 1.05 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 1156-BBGA, FCBGA | |
| Supplier Device Package | 1156-FCBGA (35x35) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6VLX130T-3FF1156C | |
| Related Links | XC6VLX130, XC6VLX130T-3FF1156C Datasheet, Xilinx Distributor | |
![]() | ATS-55375D-C2-R0 | HEAT SINK 37.5 X 37.5 X 9.5MM | datasheet.pdf | |
![]() | V110C5H75BL | CONVERTER MOD DC/DC 5V 75W | datasheet.pdf | |
![]() | VI-22Y-EY-F2 | CONVERTER MOD DC/DC 3.3V 33W | datasheet.pdf | |
![]() | TNM3-8-74-1 | ROUND STANDOFF M3 NYLON 74MM | datasheet.pdf | |
![]() | M1610 SL002 | CABLE 10COND 28AWG SHLD 500' | datasheet.pdf | |
![]() | 1408752 | NETWORK CABLE 8POS M12-CBL | datasheet.pdf | |
![]() | ATS-05H-91-C3-R0 | HEATSINK 40X40X10MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-20D-156-C3-R0 | HEATSINK 40X40X25MM L-TAB T412 | datasheet.pdf | |
![]() | 1-2083039-1 | CBLASSY MINI HVL 6WAY DIS TO PIG | datasheet.pdf | |
![]() | G5LE14DC36 | RELAY GEN PURPOSE | datasheet.pdf | |
![]() | 81281513 | MICROVALVE WITH LEVER NC VERTICA | datasheet.pdf | |
![]() | BACC63CB20A39P9 | 26500 39C 37#20 2#16 P BY PLUG | datasheet.pdf |