Xilinx XCE7K325T-1FBG676C

XCE7K325T-1FBG676C picture photo
Mfg. Part Number
XCE7K325T-1FBG676C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array, 25475 CLBs, PBGA676 IC
Datasheet Download
XCE7K325T-1FBG676C.pdf
Availability of XCE7K325T-1FBG676C

Available Quantity

11700 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XCE7K325T-1FBG676C, we specialize in Xilinx all series electronic components. XCE7K325T-1FBG676C can be shipped within 24 hours after order. If you have any demands for XCE7K325T-1FBG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCE7K325T-1FBG676C Order Process
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Specifications of XCE7K325T-1FBG676C
Internal Part NumberEIS-XCE7K325T-1FBG676C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCE7K325T-1FBG676C today
SeriesXCE7K325T
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.39.00.01
Number of CLBs25475
Number of Terminals676
Technology-
Feature25475 CLBS
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width27 mm
Length27 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max0.74 ns
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCE7K325T-1FBG676C
Alternative Part (Replacement)EIS-XCE7K325T-1FBG676C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCE7K325T, XCE7K325T-1FBG676C Datasheet, Xilinx Distributor
XCE7K325T-1FBG676C Details Description
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