Xilinx XCE7K325T-2FFV900C
- Mfg. Part Number
- XCE7K325T-2FFV900C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 25475 CLBs, PBGA900 IC
- Datasheet Download
- XCE7K325T-2FFV900C.pdf
Availability of XCE7K325T-2FFV900C
Available Quantity
9680 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCE7K325T-2FFV900C, we specialize in Xilinx all series electronic components. XCE7K325T-2FFV900C can be shipped within 24 hours after order. If you have any demands for XCE7K325T-2FFV900C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCE7K325T-2FFV900C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCE7K325T-2FFV900C
| Internal Part Number | EIS-XCE7K325T-2FFV900C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCE7K325T-2FFV900C today | |
| Series | XCE7K325T | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 25475 | |
| Number of Terminals | 900 | |
| Technology | - | |
| Feature | 25475 CLBS | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 31 mm | |
| Length | 31 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | 0.61 ns | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCE7K325T-2FFV900C | |
| Alternative Part (Replacement) | EIS-XCE7K325T-2FFV900C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCE7K325T, XCE7K325T-2FFV900C Datasheet, Xilinx Distributor | |
XCE7K325T-2FFV900C Details Description
Related parts for XCE7K325T-2FFV900C
 | 17FPR025E | RES 0.025 OHM 7W 1% AXIAL | datasheet.pdf | |
 | LTC1843CS8 | IC COMP ULTLOPWR W/REF DUAL8SOIC | datasheet.pdf | |
 | MAX638AESA+ | IC REG BUCK ADJ/5V 8SOIC | datasheet.pdf | |
 | TDA7388 | IC AMP AUD QUAD 41W FLEXIWATT25 | datasheet.pdf | |
 | CY3250-28XXX-POD | KIT REPLACEMENT PODS CY8C28XXX | datasheet.pdf | |
 | AISR-01-683J | FIXED IND 68MH 11MA 67 OHM TH | datasheet.pdf | |
 | 12062C103KAZ2A | CAP CER 10000PF 200V X7R 1206 | datasheet.pdf | |
 | VE-2N4-IX | CONVERTER MOD DC/DC 48V 75W | datasheet.pdf | |
| AFD51-20-39PX-6139 | CONN HSG RCPT STRGHT 39POS PIN | datasheet.pdf | |
| ATS-16C-104-C2-R1 | HEATSINK 40X40X12.7MM XCUT T766 | datasheet.pdf | |
| TX18AB00-1612 | CONN BACKSHELL ADPT SZ 16 16S | datasheet.pdf | |
| GTC030R36-77S | GT 7C 7#4 SKT RECP | datasheet.pdf |