Xilinx XCE7K410T-3FBG900E
- Mfg. Part Number
- XCE7K410T-3FBG900E
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 31775 CLBs, PBGA900 IC
- Datasheet Download
- XCE7K410T-3FBG900E.pdf
Availability of XCE7K410T-3FBG900E
Available Quantity
7490 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCE7K410T-3FBG900E, we specialize in Xilinx all series electronic components. XCE7K410T-3FBG900E can be shipped within 24 hours after order. If you have any demands for XCE7K410T-3FBG900E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCE7K410T-3FBG900E Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCE7K410T-3FBG900E
| Internal Part Number | EIS-XCE7K410T-3FBG900E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCE7K410T-3FBG900E today | |
| Series | XCE7K410T | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 31775 | |
| Number of Terminals | 900 | |
| Technology | - | |
| Feature | 31775 CLBS | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 31 mm | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | 0.58 ns | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCE7K410T-3FBG900E | |
| Alternative Part (Replacement) | EIS-XCE7K410T-3FBG900E | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCE7K410T, XCE7K410T-3FBG900E Datasheet, Xilinx Distributor | |
XCE7K410T-3FBG900E Details Description
Related parts for XCE7K410T-3FBG900E
 | DM74AS157N | IC SELECTOR/MUX QUAD 2-1 16-DIP | datasheet.pdf | |
| PDR-V468 | PHOTODIODE 680NM 17.74MM SQ TO-5 | datasheet.pdf | |
 | MLG1608B1N8ST000 | FIXED IND 1.8NH 600MA 100 MOHM | datasheet.pdf | |
 | AEH15G48 | CONV DC-DC 50W 48VIN 2.5V POS-EN | datasheet.pdf | |
| HSC28DRYN-S93 | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
 | 179-009-513R491 | D-Sub Connector Receptacle, Female Sockets 9, 9 Position Through Hole, Right Angle Solder | datasheet.pdf | |
 | MT41K128M16HA-15E IT:D | IC DDR3 SDRAM 2GBIT 667MHZ 96BGA | datasheet.pdf | |
 | C1221/21 M10 THD | BOOT PUSHBUTTON W/RND INSERT | datasheet.pdf | |
 | TG2030-320-320-1.0-0 | TG SERIES SHEET 320X320X1MM | datasheet.pdf | |
| 66527-512LF | Connector Receptacle 24 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
| ATS-12C-149-C1-R0 | HEATSINK 35X35X20MM L-TAB | datasheet.pdf | |
| ATS-10E-185-C2-R0 | HEATSINK 40X40X30MM R-TAB T766 | datasheet.pdf |