Xilinx XCV812E-8BG676C
- Mfg. Part Number
- XCV812E-8BG676C
- Manufacturer
- Xilinx
- Product Category
- XILINX IC
- Brief Description
- Virtex-E 1.8 V Extended Memory FPGA Field Programmable Gate Arrays IC
- Datasheet Download
- XCV812E-8BG676C.pdf
Availability of XCV812E-8BG676C
Available Quantity
7119 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCV812E-8BG676C, we specialize in Xilinx all series electronic components. XCV812E-8BG676C can be shipped within 24 hours after order. If you have any demands for XCV812E-8BG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCV812E-8BG676C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCV812E-8BG676C
| Internal Part Number | EIS-XCV812E-8BG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCV812E-8BG676C today. | |
| Series | XCV812E | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Mounting Type | SMD Surface Mount / Through Hole | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ (Standard Package Quantity) | 1 | |
| MOQ | 1 Piece | |
| Application | Industrial or Military for XCV812E-8BG676C | |
| Alternative Part (Replacement) | EIS-XCV812E-8BG676C | |
| Country of Origin | USA | |
| Weight | 0.001KG | |
| Additional Services | Programming, tape packing or any other services you need | |
| Distributor | Excellent Integrated System LIMITED | |
| XILINX Product Category | IC, FPGA, CPLD, SOC, MCU, DSP, MPU | |
| Related Links | XCV812E, XCV812E-8BG676C Datasheet, Xilinx Distributor | |
XCV812E-8BG676C Details Description
Related parts for XCV812E-8BG676C
 | MIC39101-3.3BM | IC REG LDO 3.3V 1A 8SOIC | datasheet.pdf | |
 | CRCW02012K15FKED | RES SMD 2.15K OHM 1% 1/20W 0201 | datasheet.pdf | |
 | MS27656T15F97SA | CONN RCPT 12POS WALL MNT W/SCKT | datasheet.pdf | |
 | 1-1337447-0 | CONN BNC JACK STR 50 OHM SOLDER | datasheet.pdf | |
| ECC18DCMS-S371 | CONN EDGECARD 36POS .100" | datasheet.pdf | |
| ATS-17F-90-C1-R0 | HEATSINK 35X35X35MM R-TAB | datasheet.pdf | |
| ATS-07E-52-C2-R0 | HEATSINK 30X30X25MM L-TAB T766 | datasheet.pdf | |
| KJB6T23F55AD | CONN HSG PLUG 55POS CABLE PIN | datasheet.pdf | |
| VF28525000J0G | 508 TB SOC WF VERTICAL | datasheet.pdf | |
| 51939-796LF | R/A HDR POWERBLADE | datasheet.pdf | |
| ATSAMA5D23A-CN | IC MCU CORTEX A5 196TFBGA | datasheet.pdf | |
 | XC4036XL-BG352CMN | IC FPGA 288 I/O 352MBGA | datasheet.pdf |