Xilinx XCV812EFG900-8C
- Mfg. Part Number
- XCV812EFG900-8C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- IC FPGA 404 I/O 560MBGA
- Datasheet Download
- XCV812EFG900-8C.pdf
Availability of XCV812EFG900-8C
Available Quantity
12820 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCV812EFG900-8C, we specialize in Xilinx all series electronic components. XCV812EFG900-8C can be shipped within 24 hours after order. If you have any demands for XCV812EFG900-8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCV812EFG900-8C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCV812EFG900-8C
| Internal Part Number | EIS-XCV812EFG900-8C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCV812EFG900-8CXC2V10000-4BG575C in 1 day. | |
| Full Details | Fast, Extended Block RAM, 1.8 V FPGA, Highly Flexible SelectI/O+ Technology | |
| Series | XCV812EF | |
| Lifecycle status | - | |
| RoHS Status | - | |
| HTS Code | 8542.39.00.00 | |
| Number of CLBs | - | |
| Package Code | BGA-900D | |
| Surface Mount | SMD/Through Hole | |
| Moisture Sensitivity Level | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCV812EFG900-8C | |
| Alternative Part (Replacement) | EIS-XCV812EFG900-8C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Product Category | Virtex-EM 1.8V FPGAs | |
| Product Family | FPGA Familis | |
| Product Series Type | Virtex-EM 1.8V FPGAs | |
| Related Links | XCV812E, XCV812EFG900-8C Datasheet, Xilinx Distributor | |
XCV812EFG900-8C Details Description
Related parts for XCV812EFG900-8C
 | 640713-2 | CONN STRAIN RELIEF 2POS IN LINE | datasheet.pdf | |
 | LM2902N | IC OPAMP GP 1.2MHZ 14DIP | datasheet.pdf | |
 | LTC1663CS5#TRMPBF | IC DAC 10BIT R-R TSOT23-5 | datasheet.pdf | |
 | RT1206DRE0797K6L | RES SMD 97.6K OHM 0.5% 1/4W 1206 | datasheet.pdf | |
 | TDA1072AT/V4,112 | IC AM RECEIVER CIRCUIT 16SOIC | datasheet.pdf | |
 | GBM22DTKD | CONN EDGECARD 44POS DIP .156 SLD | datasheet.pdf | |
| RMM28DSEN-S13 | CONN EDGECARD 56POS .156 EXTEND | datasheet.pdf | |
 | FTSH-110-01-L-DV-K-P-TR | CONN UNSHROUDED HDR 20POS .05" | datasheet.pdf | |
 | CMF5522K100BHEA | RES 22.1K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
| 2701497 | AXL E PB DI8 DO8 M12 6P | datasheet.pdf | |
 | 416F38025CDR | CRYSTAL 38.000 MHZ 18PF SMT | datasheet.pdf | |
 | LDB311G9005C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |