Xilinx XCVU080-1HFFVB1760E
- Mfg. Part Number
- XCVU080-1HFFVB1760E
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array IC
- Datasheet Download
- XCVU080-1HFFVB1760E.pdf
Availability of XCVU080-1HFFVB1760E
Available Quantity
11350 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCVU080-1HFFVB1760E, we specialize in Xilinx all series electronic components. XCVU080-1HFFVB1760E can be shipped within 24 hours after order. If you have any demands for XCVU080-1HFFVB1760E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCVU080-1HFFVB1760E Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCVU080-1HFFVB1760E
| Internal Part Number | EIS-XCVU080-1HFFVB1760E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCVU080-1HFFVB1760E today | |
| Series | XCVU080-1H | |
| Lifecycle status | Active-Unconfirmed | |
| RoHS Status | Contact us | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | - | |
| Technology | - | |
| Feature | - | |
| Package Code | - | |
| Package Shape | - | |
| Package Style | - | |
| Surface Mount | - | |
| Width | - | |
| Length | - | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | - | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCVU080-1HFFVB1760E | |
| Alternative Part (Replacement) | EIS-XCVU080-1HFFVB1760E | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCVU080-1, XCVU080-1HFFVB1760E Datasheet, Xilinx Distributor | |
XCVU080-1HFFVB1760E Details Description
Related parts for XCVU080-1HFFVB1760E
 | CD74HCT123M96G4 | IC DUAL RETRIG MULTIVIB 16-SOIC | datasheet.pdf | |
 | CY7C1315JV18-300BZC | IC SRAM 18MBIT 300MHZ 165FBGA | datasheet.pdf | |
 | RNF-100-1-BU-FSP | HEAT SHRINK TUBING | datasheet.pdf | |
 | CMF6025R000BER6 | RES 25 OHM 1W 0.1% AXIAL | datasheet.pdf | |
.jpg) | CR0805-FX-2100ELF | RES SMD 210 OHM 1% 1/8W 0805 | datasheet.pdf | |
| 83269838 | SWITCH SNAP ACTION 0.05A SPST | datasheet.pdf | |
| 802-80-016-30-001101 | CONN HDR 16POS 0.100 SMD | datasheet.pdf | |
 | MDMK4040T4R7MM | FIXED IND 4.7UH 1.9A 160 MOHM | datasheet.pdf | |
 | PT7M6135NLTA3EX | IC SUPERVISOR | datasheet.pdf | |
 | HS250 270R F | RES CHAS MNT 270 OHM 1% 250W | datasheet.pdf | |
| MKP385147160JDA2B0 | CAP FILM 0.00047UF 5% 1600VDC AX | datasheet.pdf | |
| XC3S400-3FTG256C | IC FPGA 489 I/O 676FCBGA | datasheet.pdf |