Xilinx XCZU11EG-3FFVB1517E

XCZU11EG-3FFVB1517E picture photo
Mfg. Part Number
XCZU11EG-3FFVB1517E
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA1517 IC
Datasheet Download
XCZU11EG-3FFVB1517E.pdf
Availability of XCZU11EG-3FFVB1517E

Available Quantity

13780 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XCZU11EG-3FFVB1517E, we specialize in Xilinx all series electronic components. XCZU11EG-3FFVB1517E can be shipped within 24 hours after order. If you have any demands for XCZU11EG-3FFVB1517E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU11EG-3FFVB1517E Order Process
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Specifications of XCZU11EG-3FFVB1517E
Internal Part NumberEIS-XCZU11EG-3FFVB1517E
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU11EG-3FFVB1517E today
SeriesXCZU11EG-3
Lifecycle statusActive-Unconfirmed
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals1517
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width40 mm
Length40 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU11EG-3FFVB1517E
Alternative Part (Replacement)EIS-XCZU11EG-3FFVB1517E
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU11EG-, XCZU11EG-3FFVB1517E Datasheet, Xilinx Distributor
XCZU11EG-3FFVB1517E Details Description
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