Xilinx XCZU15EG-3FFVB1156I
- Mfg. Part Number
- XCZU15EG-3FFVB1156I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA1156 IC
- Datasheet Download
- XCZU15EG-3FFVB1156I.pdf
Availability of XCZU15EG-3FFVB1156I
Available Quantity
12380 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU15EG-3FFVB1156I, we specialize in Xilinx all series electronic components. XCZU15EG-3FFVB1156I can be shipped within 24 hours after order. If you have any demands for XCZU15EG-3FFVB1156I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU15EG-3FFVB1156I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU15EG-3FFVB1156I
| Internal Part Number | EIS-XCZU15EG-3FFVB1156I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU15EG-3FFVB1156I today | |
| Series | XCZU15EG-3 | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 1156 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 35 mm | |
| Length | 35 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | - | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU15EG-3FFVB1156I | |
| Alternative Part (Replacement) | EIS-XCZU15EG-3FFVB1156I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU15EG-, XCZU15EG-3FFVB1156I Datasheet, Xilinx Distributor | |
XCZU15EG-3FFVB1156I Details Description
Related parts for XCZU15EG-3FFVB1156I
 | MCR03EZPFX7322 | RES SMD 73.2K OHM 1% 1/10W 0603 | datasheet.pdf | |
 | GBC31DRYS | CONN EDGECARD 62POS DIP .100 SLD | datasheet.pdf | |
| CA3102E12S-3PWBF80-05 | CONN RCPT 2 POS BOX MNT W/PINS | datasheet.pdf | |
 | FDFME3N311ZT | MOSFET N-CH 30V 1.8A 6MICROFET | datasheet.pdf | |
| E3034C1.30.10 | CABLE 4COND 18AWG GRAY 1000' | datasheet.pdf | |
| VE-J3L-IY | CONVERTER MOD DC/DC 28V 50W | datasheet.pdf | |
 | L37-3-5-5-0.5 | THERMAL PAD 5X5X0.5MM | datasheet.pdf | |
| 902-BULK | CONN INLINE TAP 10-18AWG BRWN | datasheet.pdf | |
 | HSCMRRN2.5MD2A5 | SENSOR PRES 2.5MBAR DIFF 5V SMT | datasheet.pdf | |
 | EP3SL200H780I3N | IC FPGA 488 I/O 780HBGA | datasheet.pdf | |
| T0054487499 | XNT 4X SOLDERING TIP 1.2MM | datasheet.pdf | |
 | MA53101CBN | HIGH FREQUENCY CERAMIC CAPACITORS | datasheet.pdf |