Xilinx XCZU4EG-1FBVB900I
- Mfg. Part Number
- XCZU4EG-1FBVB900I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA900 IC
- Datasheet Download
- XCZU4EG-1FBVB900I.pdf
Availability of XCZU4EG-1FBVB900I
Available Quantity
13850 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU4EG-1FBVB900I, we specialize in Xilinx all series electronic components. XCZU4EG-1FBVB900I can be shipped within 24 hours after order. If you have any demands for XCZU4EG-1FBVB900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU4EG-1FBVB900I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU4EG-1FBVB900I
| Internal Part Number | EIS-XCZU4EG-1FBVB900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU4EG-1FBVB900I today | |
| Series | XCZU4EG-1 | |
| Lifecycle status | Active-Unconfirmed | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 900 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 31 mm | |
| Length | 31 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU4EG-1FBVB900I | |
| Alternative Part (Replacement) | EIS-XCZU4EG-1FBVB900I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU4EG-, XCZU4EG-1FBVB900I Datasheet, Xilinx Distributor | |
XCZU4EG-1FBVB900I Details Description
Related parts for XCZU4EG-1FBVB900I
 | 25-0513-10 | CONN SOCKET SIP 25POS GOLD | datasheet.pdf | |
| ERZ-CF2MK330 | VARISTOR 30V 50A 2-SMD J-LEAD | datasheet.pdf | |
,TO-226_straightlead.jpg) | BC547BBU | TRANS NPN 45V 0.1A TO-92 | datasheet.pdf | |
 | HCPL-263N#300 | OPTOISO 3.75KV OPEN COLL 8DIP GW | datasheet.pdf | |
| GBC43DRES | CONN EDGECARD 86POS .100 EYELET | datasheet.pdf | |
| HCC10DRAS | CONN EDGECARD 20POS R/A .100 SLD | datasheet.pdf | |
 | CS43L22-CNZR | IC DAC W/HDPN & SPKR AMPS 40-QFN | datasheet.pdf | |
 | ATMEGA1280R231-CU | BUNDLE ATMEGA1280V/RF231 PBGA | datasheet.pdf | |
 | 768776322 | FIXED IND 2.2MH 180MA 5.3 OHM | datasheet.pdf | |
| RPP30-4812D-1T | 30W DC/DC-CONV POWERLINE-PLUS | datasheet.pdf | |
| TNM8-19-96-2 | ROUND STANDOFF M8 NYLON 96MM | datasheet.pdf | |
| 06-1518-11H | CONN IC DIP SOCKET 6POS GOLD | datasheet.pdf |