Xilinx XCZU4EG-2FBVB900I
- Mfg. Part Number
- XCZU4EG-2FBVB900I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA900 IC
- Datasheet Download
- XCZU4EG-2FBVB900I.pdf
Availability of XCZU4EG-2FBVB900I
Available Quantity
7630 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU4EG-2FBVB900I, we specialize in Xilinx all series electronic components. XCZU4EG-2FBVB900I can be shipped within 24 hours after order. If you have any demands for XCZU4EG-2FBVB900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU4EG-2FBVB900I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU4EG-2FBVB900I
| Internal Part Number | EIS-XCZU4EG-2FBVB900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU4EG-2FBVB900I today | |
| Series | XCZU4EG-2 | |
| Lifecycle status | Active-Unconfirmed | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 900 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 31 mm | |
| Length | 31 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU4EG-2FBVB900I | |
| Alternative Part (Replacement) | EIS-XCZU4EG-2FBVB900I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU4EG-, XCZU4EG-2FBVB900I Datasheet, Xilinx Distributor | |
XCZU4EG-2FBVB900I Details Description
Related parts for XCZU4EG-2FBVB900I
 | MTA306H | SWITCH TOGGLE 3PDT 6A 125V | datasheet.pdf | |
| GEC44DRXI | CONN EDGECARD 88POS DIP .100 SLD | datasheet.pdf | |
 | KMPC8358ZUAGDGA | IC MPU MPC83XX 400MHZ 740TBGA | datasheet.pdf | |
/165-TBGA.jpg) | IDT71V65802S100BQ8 | IC SRAM 9MBIT 100MHZ 165CABGA | datasheet.pdf | |
| RWR89SR221DRB12 | RES 0.221 OHM 3W 0.5% WW AXIAL | datasheet.pdf | |
.jpg) | M55342E08B34B0RWS | RES SMD 34K OHM 0.1% 0.8W 2010 | datasheet.pdf | |
 | CMF55309K00FKR670 | RES 309K OHM 1/2W 1% AXIAL | datasheet.pdf | |
| E32D161LPN192MA54M | CAP ALUM 1900UF 20% 160V SCREW | datasheet.pdf | |
| 0634432311 | FINE SPACER | datasheet.pdf | |
| ATS-16E-169-C2-R0 | HEATSINK 30X30X10MM R-TAB T766 | datasheet.pdf | |
 | TEA18361LT/1J | IC CTRLR SMPS DCM/QR 14SOIC | datasheet.pdf | |
| 36DE233G010AA2A | 23000UF 10V 35X54 85C ST | datasheet.pdf |