Xilinx XCZU4EG-L2FBVB900E

XCZU4EG-L2FBVB900E picture photo
Mfg. Part Number
XCZU4EG-L2FBVB900E
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA900 IC
Datasheet Download
XCZU4EG-L2FBVB900E.pdf
Availability of XCZU4EG-L2FBVB900E

Available Quantity

10370 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XCZU4EG-L2FBVB900E, we specialize in Xilinx all series electronic components. XCZU4EG-L2FBVB900E can be shipped within 24 hours after order. If you have any demands for XCZU4EG-L2FBVB900E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU4EG-L2FBVB900E Order Process
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Specifications of XCZU4EG-L2FBVB900E
Internal Part NumberEIS-XCZU4EG-L2FBVB900E
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU4EG-L2FBVB900E today
SeriesXCZU4EG-L
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals900
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeRECTANGULAR
Package StyleGRID ARRAY Meter
Surface MountYES
Width-
Length-
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU4EG-L2FBVB900E
Alternative Part (Replacement)EIS-XCZU4EG-L2FBVB900E
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU4EG-L, XCZU4EG-L2FBVB900E Datasheet, Xilinx Distributor
XCZU4EG-L2FBVB900E Details Description
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