Xilinx XCZU4EV-3FBVB900I

XCZU4EV-3FBVB900I picture photo
Mfg. Part Number
XCZU4EV-3FBVB900I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA900 IC
Datasheet Download
XCZU4EV-3FBVB900I.pdf
Availability of XCZU4EV-3FBVB900I

Available Quantity

7140 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XCZU4EV-3FBVB900I, we specialize in Xilinx all series electronic components. XCZU4EV-3FBVB900I can be shipped within 24 hours after order. If you have any demands for XCZU4EV-3FBVB900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU4EV-3FBVB900I Order Process
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Specifications of XCZU4EV-3FBVB900I
Internal Part NumberEIS-XCZU4EV-3FBVB900I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU4EV-3FBVB900I today
SeriesXCZU4EV-3
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals900
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width31 mm
Length31 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)-
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU4EV-3FBVB900I
Alternative Part (Replacement)EIS-XCZU4EV-3FBVB900I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU4EV-, XCZU4EV-3FBVB900I Datasheet, Xilinx Distributor
XCZU4EV-3FBVB900I Details Description
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