Xilinx XCZU5EG-3FBVB900I
- Mfg. Part Number
- XCZU5EG-3FBVB900I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA900 IC
- Datasheet Download
- XCZU5EG-3FBVB900I.pdf
Availability of XCZU5EG-3FBVB900I
Available Quantity
6630 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU5EG-3FBVB900I, we specialize in Xilinx all series electronic components. XCZU5EG-3FBVB900I can be shipped within 24 hours after order. If you have any demands for XCZU5EG-3FBVB900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU5EG-3FBVB900I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU5EG-3FBVB900I
| Internal Part Number | EIS-XCZU5EG-3FBVB900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU5EG-3FBVB900I today | |
| Series | XCZU5EG-3 | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 900 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 31 mm | |
| Length | 31 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | - | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU5EG-3FBVB900I | |
| Alternative Part (Replacement) | EIS-XCZU5EG-3FBVB900I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU5EG-, XCZU5EG-3FBVB900I Datasheet, Xilinx Distributor | |
XCZU5EG-3FBVB900I Details Description
Related parts for XCZU5EG-3FBVB900I
 | MAZS0560ML | DIODE ZENER 5.6V 150MW SSMINI2 | datasheet.pdf | |
 | CCM04-1317 | CONN SMART CARD PUSH-PULL R/A | datasheet.pdf | |
 | LTC1604AIG#TR | IC ADC 16BIT SAMPL SHTDWN 36SSOP | datasheet.pdf | |
 | AD737ARZ | IC TRUE RMS/DC CONV LP 8SOIC | datasheet.pdf | |
 | AYM10DTAN | CONN EDGECARD 20POS R/A .156 SLD | datasheet.pdf | |
 | H11F3SVM | OPTOISOLTR 7.5KV PHOTO FET 6-SMD | datasheet.pdf | |
| 5-1879690-6 | RES 46.4K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
 | 6-1879275-7 | RES SMD 4.32K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
 | LT3030HFE#PBF | IC REG LDO ADJ 20TSSOP | datasheet.pdf | |
 | 850-10-034-10-001101 | CONN HDR 34POS 1.27MM T/H | datasheet.pdf | |
| 88886-140HLF | HEADER BERGSTIK | datasheet.pdf | |
| 2701489 | AXL E EIP DIO16 M12 6M | datasheet.pdf |