Xilinx XCZU6EG-3FFVB1156E

XCZU6EG-3FFVB1156E picture photo
Mfg. Part Number
XCZU6EG-3FFVB1156E
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA1156 IC
Datasheet Download
XCZU6EG-3FFVB1156E.pdf
Availability of XCZU6EG-3FFVB1156E

Available Quantity

11720 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XCZU6EG-3FFVB1156E, we specialize in Xilinx all series electronic components. XCZU6EG-3FFVB1156E can be shipped within 24 hours after order. If you have any demands for XCZU6EG-3FFVB1156E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU6EG-3FFVB1156E Order Process
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Specifications of XCZU6EG-3FFVB1156E
Internal Part NumberEIS-XCZU6EG-3FFVB1156E
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU6EG-3FFVB1156E today
SeriesXCZU6EG-3
Lifecycle statusActive-Unconfirmed
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals1156
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width35 mm
Length35 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU6EG-3FFVB1156E
Alternative Part (Replacement)EIS-XCZU6EG-3FFVB1156E
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU6EG-3, XCZU6EG-3FFVB1156E Datasheet, Xilinx Distributor
XCZU6EG-3FFVB1156E Details Description
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