Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XL25-30-30-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Heat Sinks | |
| Series | XL-25 | |
| Type | Heat Spreader | |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
| Attachment Method | - | |
| Shape | Square | |
| Length | 1.181" (30.00mm) | |
| Width | 1.181" (30.00mm) | |
| Diameter | - | |
| Height Off Base (Height of Fin) | 0.079" (2.00mm) | |
| Power Dissipation @ Temperature Rise | - | |
| Thermal Resistance @ Forced Air Flow | - | |
| Thermal Resistance @ Natural | - | |
| Material | Ceramic | |
| Material Finish | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XL25-30-30-2 | |
| Related Links | XL25-3, XL25-30-30-2 Datasheet, t-Global Technology Distributor | |
![]() | BUF11702PWP | IC HI CURRNT BUFF 11CH 28-HTSSOP | datasheet.pdf | |
![]() | CRCW06034R30JNEA | RES SMD 4.3 OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | ESC19DTEI | CONN EDGECARD 38POS .100 EYELET | datasheet.pdf | |
![]() | MAX1242AESA+ | IC ADC 10BIT SERIAL 8-SOIC | datasheet.pdf | |
![]() | 1717832-2 | LATCH 52POS MINI PCI | datasheet.pdf | |
![]() | MS27497T16B6PA | CONN RCPT 6POS WALL MNT W/PINS | datasheet.pdf | |
![]() | RS3-0505D/H2 | CONV DC/DC 3W 4.5-9VIN +/-05VOUT | datasheet.pdf | |
![]() | OSTEM177152 | TERM BLOCK PLUG 17POS 225DEG 5MM | datasheet.pdf | |
![]() | TMM-106-01-L-D-SM-P-TR | CONN HEADER 12POS DBL 2MM SMD | datasheet.pdf | |
![]() | VI-25K-MU-F3 | CONVERTER MOD DC/DC 40V 200W | datasheet.pdf | |
![]() | CR18NSC | PES M18 RETRO NPN 2.0M | datasheet.pdf | |
![]() | 8N4SV75FC-0150CDI | IC OSC VCXO 100MHZ 6-CLCC | datasheet.pdf |