Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XS1-G02B-FB144-C4 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 176 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | XS1 | |
| Packaging | Tray | |
| Core Processor | XCore | |
| Core Size | 32-Bit Dual-Core | |
| Speed | 400MIPS | |
| Connectivity | Configurable | |
| Peripherals | - | |
| Number of I/O | 88 | |
| Program Memory Size | 128KB (32K x 32) | |
| Program Memory Type | SRAM | |
| EEPROM Size | - | |
| RAM Size | - | |
| Voltage - Supply (Vcc/Vdd) | 0.95 V ~ 3.6 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LFBGA | |
| Supplier Device Package | 144-FBGA (11x11) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XS1-G02B-FB144-C4 | |
| Related Links | XS1-G02B, XS1-G02B-FB144-C4 Datasheet, XMOS Distributor | |
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