Eutelsat expected to take over OneWeb this week
Eutelsat, the French satellite operator, is expected to announce a merger with OneWeb this week
This article was posted on Jul 29, 2022CEM Nemco joins Manufacturing Assembly Network
Contract electronics manufacturer Nemco has joined the Manufacturing Assembly Network (MAN), the collective of eight sub-contract manufacturers and and an engineering design agency.
This article was posted on Jul 29, 2022EW BrightSparks 2022 profile: Charlotte Fitzpatrick
Now in its fifth year of awards, EW BrightSparks sees Electronics Weekly partner with RS Grass Roots to highlight the brightest and most talented young engineers in the UK today.
This article was posted on Jul 28, 2022Astraius propulsion deals boost Scottish space launches
Astraius, the UK-based horizontal launch company due to operate out of Scotland, has announced Northrop Grumman and Exquadrum as its key propulsion suppliers.
This article was posted on Jul 28, 2022US chip companies account for 56% of global R&D spend
US chip vendors continued to dominate R&D spending in 2021, says IC Insights, while companies in Asia-Pac accounted for nearly one-third.
This article was posted on Jul 28, 2022SkyWater to build $1.8bn IC R&D facility at Purdue
SkyWater, the Minnesota hi-rel fab – plans to invest $1.8 billion for an IC R&D research facility in Indiana, in partnership with the state and Purdue University.
This article was posted on Jul 28, 2022ST and VW hook up on ICs
ST and VW’s software unit Cariad are joining up to co-design automotive chips and are “moving to agree” that TSMC will fab them
This article was posted on Jul 28, 2022Samsung upgrades SmartSSD
Samsung has upgraded its SmartSSD which processes data directly, thereby minimising data transfers between the CPU, GPU and RAM.
This article was posted on Jul 28, 2022ASML warns about supply chain effects if DUV shipments to China are stopped
ASML, which is coming under US pressure to stop selling DUV litho tools to China, says doing so could affect workwide IC supply chains.
This article was posted on Jul 28, 2022Hynix postpones NAND fab extension
Hynix has postponed a$3.3 billion expansion of its NAND fab in the Korean city of Cheongju in response to an over-supplied market, lagging demand and diving prices.
This article was posted on Jul 28, 2022KORA O-RAN testing moves to the cloud
Keysight Open Radio Access Network Architect (KORA) test solutions are moving to cloud-based deployment for improved flexibility and rapid deployment.
This article was posted on Jul 28, 2022Antenova launches 40x10x3.3mm SMD antenna for 5G
Antenova of Hatfield has brought out a smaller SMD antenna for 5G and 4G frequencies. The antenna is named Minima, part number SR4L075.
This article was posted on Jul 28, 2022NAND over-supplied and under-bought: Q3 ASP to fall 8-13%
An over-supplied NAND market, which intensified in Q2 due to lagging demand and continued process advancement, will see Q3 prices down 8-13% with Q4 likely to see a continuation of the trend, says TrendForce,
This article was posted on Jul 27, 2022US Senate passes enabling measure for Chips Act vote in next two weeks
Yesterday the US Senate voted 64-34 for a measure enabling the passing of the Chips Act in the next two weeks.
This article was posted on Jul 27, 2022ASML increases revenue and profit
ASML had a Q2 profit of €1.41 billion, up from €1.04 billion in Q2 2021.
This article was posted on Jul 27, 2022Mornsun’s medical power supplies are available on short lead times from Relec
Two medical-certified power supplies by Mornsun have been added to the range available from Relec. The 45W LO45 and 65W LO65 series of ac-dc converters are available on short lead times of 10 – 12 weeks.
This article was posted on Jul 27, 2022NXP and Foxconn to develop connected vehicles
NXP today announced that it has signed an MOU with Foxconn to jointly develop platforms for connected vehicles.
This article was posted on Jul 27, 2022Test socket with less cross-talk for 350μm pitch ICs
Smiths Interconnect has created an IC test socket for high-speed testing of 350μm minimum pitch devices.
This article was posted on Jul 27, 2022A helping hand for robotic arms
A clinical trial for a robotic arm based on neuromorphic computing could increase independence for spinal, neuromuscular injury patients, writes Caroline Hayes.
This article was posted on Jul 27, 2022Get ahead, get an asic
In a rapidly digitalising world where every electronic product is getting smaller and smarter, standing out from the crowd may seem out of reach for manufacturers. But custom IC design can enable true product differentiation, says Richard Mount.
This article was posted on Jul 27, 2022PICMG makes a point to prepare for the future
At last month’s Embedded World, the PCI Industrial Computer Manufacturer’s Group announced plans to update the MicroTCA and new specifications for COM-HPC. By Caroline Hayes.
This article was posted on Jul 27, 2022