Q3 DRAM ASP To Fall 5-10%
Q3 DRAM ASPs are expected to show a 5-10% fall q-o-q, says TrendForce.
This article was posted on Jul 11, 2022Infineon buys NoBug
Infineon has bought the Romanian chip verification and design specialist NoBug.
This article was posted on Jul 11, 2022ISO26262 and ASI-B compliant PMICs for automotive camera modules
ROHM is sampling ISO 26262 and ASIL-B compliant PMICs, BD868xxMUF-C (BD868C0MUF-C, BD868D0MUF-C), for automotive camera modules that are increasingly being adopted in ADAS. Shipments Of OEM quantities start August.
This article was posted on Jul 8, 2022EW BrightSparks 2022 profile: Daisy Bristow
Now in its fifth year of awards, EW BrightSparks sees Electronics Weekly partner with RS Grass Roots to highlight the brightest and most talented young engineers in the UK today.
This article was posted on Jul 8, 2022Avio receives “Next Gen EU” boost for liquid propulsion launchers
Avio, the Italian aerospace engine specialist, has won contracts worth €338 million from the Italian government to boost the country’s space industry and liquid propulsion expertise.
This article was posted on Jul 8, 2022Intel Foundry adds allies for cloud-based design services
The Intel Foundry Services (IFS) Cloud Alliance which enables design facilities in the cloud and optimised EDA tools while meeting the requirements of Intel’s PDKs, now consists of AWS, Microsoft Azure, Ansys, Cadence, Siemens EDA and Synopsys.
This article was posted on Jul 8, 2022Sponsored Content: Silicon lifecycle solutions help you listen to your chip
New trends in semiconductors bring fresh challenges and innovative solutions. Next-generation SoCs are designed for electronic systems that require higher levels of reliability, safety, performance, and security.
This article was posted on Jul 8, 2022Sondrel recruits head of asic services
UK Asic design consultancy Sondrel has recruited industry veteran Gareth Jones, with over 25 years of asic and foundry experience, to head up its asic services.
This article was posted on Jul 8, 2022Melexis launches 2mm x 2.5mm pico-resolver
Melexis has launched the MLX90381 AEC-Q100/ISO 26262 compliant pico-resolver for industrial and automotive applications.
This article was posted on Jul 8, 2022Harwin adds to Datamate range
Harwin has announced an addition to its Datamate family of 2mm-pitch high-reliability (Hi-Rel) connectors.
This article was posted on Jul 8, 2022EW BrightSparks 2022 profile: Virginia Cangelosi
Now in its fifth year of awards, EW BrightSparks sees Electronics Weekly partner with RS Grass Roots to highlight the brightest and most talented young engineers in the UK today.
This article was posted on Jul 8, 2022UKRI funding boost for semiconductor R&D at National Epitaxy Facility
The National Epitaxy Facility, a collaboration between the Universities of Sheffield, Cambridge and UCL for semiconductor R&D, has been awarded a further £12 million in funding.
This article was posted on Jul 8, 2022Korea’s memory inventory grows
May’s menory inventory in Korea rose by its highest amount in four years, says Statistics Korea.
This article was posted on Jul 7, 2022US tech controls squeezing the Russians
The US and its allies are squeezing the Russians by denying them technology, said the US Secretary of Commerce Gina Raimondo (pictured) earlier this week.
This article was posted on Jul 7, 2022Top 5 MPU suppliers take 86% share
The top five MPU suppliers took their market share to 86% in 2021, says IC Insights, with Intel edging closer to half the total sales in microprocessors.
This article was posted on Jul 7, 2022Samsung first to 3nm
Today, Samsung announced that it has started initial production of its 3nm process node applying Gate-All-Around (GAA) transistor architecture.
This article was posted on Jul 7, 2022Raspberry Pi puts Wi-Fi onto Pico for $6, and maybe Bluetooth
Raspberry Pi has added a wireless module to its Pico microcontroller board, giving it 802.11n Wi-Fi capability – all for $6.
This article was posted on Jul 7, 2022100V 10μF MLCC in 1210
Distributor Rutronik is stocking a 100V multi-layer ceramic capacitor (MLCCs) from Samsung Electro-Mechanics.
This article was posted on Jul 7, 2022I3C agreed as a bus for secure authentication
The MIPI Alliance and ETSI have adopted the ‘I3C Interface for SSP’ specification, allowing the MIPI I3C Basic specification to serve as a physical and logical link layer for the ETSI SSP (Smart Secure Platform).
This article was posted on Jul 7, 2022Dumb stick-on knob adds rotary encoder to touch screen
Microchip has introduced a touch controller family for ‘knob-on-display’ (KoD) human-machine interfaces.
This article was posted on Jul 7, 2022EW BrightSparks 2022 profile: Sergio Miguez Aparicio
Now in its fifth year of awards, EW BrightSparks sees Electronics Weekly partner with RS Grass Roots to highlight the brightest and most talented young engineers in the UK today.
This article was posted on Jul 6, 2022