A research team from the Technical University of Munich and the Division of Infectious Diseases and Tropical Medicine at the LMU University Hospital Munich, in cooperation with the start-up Smart United GmbH, has developed an invisible protective “wall” made of UV-C light.
This article was posted on Jan 6, 2022Yesterday, OneWeb, the satellite constellation backed by the UK government and Bharti Enterprises, launched 36 satellites from the Baikonur cosmodrome in Kazakhstan.
This article was posted on Jan 6, 2022TE Connectivity (TE) has acquired force-guided narrow safety relay (NSR) technology from the Phoenix Contact Group.
This article was posted on Jan 6, 2022Weebit Nano has received from manufacturing the first silicon wafers that integrate its embedded ReRAM module inside complete subsystem demonstration (demo) chips.
This article was posted on Jan 6, 2022From January 1st, India is taking applications from chip companies to set up fabs in India.
This article was posted on Jan 6, 2022Raspberry Pi has come up with the Trilobot robot kit.
This article was posted on Jan 6, 2022Kyocera has unveiled its HAPTIVITY iHMI technology —a hybrid innovation combining touch technology with 3D injection-moulded structural electronics technology (IMSET) from TactoTek Oy.
This article was posted on Jan 5, 2022A low-power system for use in bionic eyes, has been jointly developed by academics from the Harbin Institute of Technology in China and Northumbria University.
This article was posted on Jan 5, 2022Samsung is sampling an SSD for enterprise servers, integrating the PCIe 5.0 interface with Samsung’s sixth-generation V-NAND.
This article was posted on Jan 5, 2022Lattice has also announced the release of an updated version of the Lattice Propel embedded design environment to simplify the development of industrial automation systems with improved performance and added functionality supporting RISC-V soft processor cores.
This article was posted on Jan 5, 2022ams OSRAM is expanding its portfolio of dToF modules with three new devices for multi-zone and multi-object detection with a wider field-of-view (FoV) and extended range.
This article was posted on Jan 5, 2022SEMI’s November billings figure was 5% up on October’s $3.74 billion at $3.93 billion and 50.6% up on November 2020’s billings of $2.61 billion.
This article was posted on Jan 5, 2022Japan must aim for 2nm mass production within a decade, says Tetsuro (Terry) Higashi (pictured) former CEO of Tokyo Electron who sits on a government chip industry advisory panel.
This article was posted on Jan 5, 2022Here’s a quick post to wish all our readers, as always, a Merry Christmas and a Happy New Year!
This article was posted on Jan 5, 2022ADI has introduced a multi-phase synchronous boost controller that regulates high-power Class-D amplifiers in automotive infotainment systems.
This article was posted on Jan 5, 2022Building a large-scale physical quantum computer is challenging. When scaling up qubits, wiring diagrams get increasingly complicated. Bogdan Govoreanu, quantum computing program manager at Imec, has shown a smart way of interconnecting neighboring silicon qubits in a 2D bilinear array.
This article was posted on Jan 5, 202217 semiconductor companies are forecast to have sales of $10 billion or more this year, says IC Insights.
This article was posted on Jan 4, 2022SL Power Electronics, a global leader in designing and manufacturing AC/DC power conversion solutions, announces the availability of the GB130Q family of highly efficient, 130W quad output power supplies in a 3″ X 5″ Open frame form factor.
This article was posted on Jan 4, 2022Eutelsat, the Paris-based satellite operator, has appointed a new CEO with effect from the New Year – Eva Berneke.
This article was posted on Jan 4, 2022Murata and Michelin are in volume of RFID modules that embed into tyres.
This article was posted on Jan 4, 2022NEC says it has successfully demonstrated its O-RAN massive MIMO capabilities for the O-RAN ALLIANCE Global PlugFest 2021 at five of its venues, hosted by leading operators and the Telecom Infra Project (TIP).
This article was posted on Jan 4, 2022