ams OSRAM adds to dToF portfolio
ams OSRAM is expanding its portfolio of dToF modules with three new devices for multi-zone and multi-object detection with a wider field-of-view (FoV) and extended range.
This article was posted on Jan 5, 2022SEMI November billings up 50.6% y-o-y
SEMI’s November billings figure was 5% up on October’s $3.74 billion at $3.93 billion and 50.6% up on November 2020’s billings of $2.61 billion.
This article was posted on Jan 5, 2022Japan needs to spend $7bn a year on chips, says Higashi
Japan must aim for 2nm mass production within a decade, says Tetsuro (Terry) Higashi (pictured) former CEO of Tokyo Electron who sits on a government chip industry advisory panel.
This article was posted on Jan 5, 2022Merry Christmas! But the Web never sleeps…
Here’s a quick post to wish all our readers, as always, a Merry Christmas and a Happy New Year!
This article was posted on Jan 5, 2022ADI multi-phase boost controller
ADI has introduced a multi-phase synchronous boost controller that regulates high-power Class-D amplifiers in automotive infotainment systems.
This article was posted on Jan 5, 2022How to build a quantum computer
Building a large-scale physical quantum computer is challenging. When scaling up qubits, wiring diagrams get increasingly complicated. Bogdan Govoreanu, quantum computing program manager at Imec, has shown a smart way of interconnecting neighboring silicon qubits in a 2D bilinear array.
This article was posted on Jan 5, 202217 IC companies have $10bn+ revenues
17 semiconductor companies are forecast to have sales of $10 billion or more this year, says IC Insights.
This article was posted on Jan 4, 2022130W quad output power supply in 3”x5” format
SL Power Electronics, a global leader in designing and manufacturing AC/DC power conversion solutions, announces the availability of the GB130Q family of highly efficient, 130W quad output power supplies in a 3″ X 5″ Open frame form factor.
This article was posted on Jan 4, 2022Eutelsat appoints a Danish CEO – Eva Berneke
Eutelsat, the Paris-based satellite operator, has appointed a new CEO with effect from the New Year – Eva Berneke.
This article was posted on Jan 4, 2022RFID tag the size of a grain of rice embeds in tyres
Murata and Michelin are in volume of RFID modules that embed into tyres.
This article was posted on Jan 4, 2022PlugFests demo NEC’s MIMO O-RAN
NEC says it has successfully demonstrated its O-RAN massive MIMO capabilities for the O-RAN ALLIANCE Global PlugFest 2021 at five of its venues, hosted by leading operators and the Telecom Infra Project (TIP).
This article was posted on Jan 4, 2022SiPho process has integrated III-V lasers
Tower Semiconductor and Juniper Networks have developed a silicon photonics (SiPho) foundry-ready process with integrated III-V lasers, amplifiers modulators and detectors.
This article was posted on Jan 4, 2022TrekApp tool tests stress in SoC and processor designs
Verification and stimulus specialist, Breker Verification Systems, has taken its Cache Coherency TrekApp as the basis for the System Coherency Synthesis TrekApp, which it introduced at DAC58 in San Francisco. The tool uses abstract models of common and novel algorithms to automatically generate high coverage coherency tests for complex, multi-agent system platforms based on coverage directives. The TrekApp can be configured for Arm, RISC-V and other processor configurations, together with a range of storage and I/O architectures.
This article was posted on Jan 4, 2022Edge inference accelerator has an eye on Megapixel vision systems
An edge inference accelerator developed by Flexlogix has a 4k MAC dynamic tensor processor array and is optimised for Mpixel image processing models in medical, surveillance and IoT applications.
This article was posted on Jan 4, 2022Compact AC/DC converter ICs
ROHM has developed AC/DC fly-back converter ICs with an integrated 730V breakdown MOSFET: the BM2P06xMF-Z series (BM2P060MF-Z, BM2P061MF-Z, and BM2P063MF-Z).
This article was posted on Jan 4, 2022Hitachi launches e-beam inspection system for EUV 3nm and 5nm processes
Hitachi High-Tech Corporation today announced the Development of its Electron Beam Area Inspection System.
This article was posted on Jan 4, 2022eGaN chipset shrinks size for high power density design
The ePower chipset family of 100V, 65A IC chipsets integrate a 100V EPC23101 eGaN driver and EPC2302 eGaN FET. Developed by Efficient Power Conversion (EPC), they reduce the solution size for high power density applications, including 48V DC-DC conversion in computing and brushless DC (BLDC) motor drives for e-mobility, robotics and drones.
This article was posted on Dec 30, 2021High energy density capacitors are up to 90% lighter than ceramics
Miniature micro-layer (MML) film capacitors offer energy density of 400j/dm3 for weight and size reductions compared to polypropylene or polyester dielectrics. The capacitors developed by Exxelia are available from New Yorker Electronics.
This article was posted on Dec 30, 2021Ageing experiment goes into space
Tomorrow, a government-backed experiment into ageing is set to launch to the International Space Station.
This article was posted on Dec 30, 2021EiceDRIVER family to enhance GaN SG HEMTs
Infineon is shipping the EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver ICs family.
This article was posted on Dec 30, 2021Inductive sensing IC immune to stray magnetic fields
Melexis, the Belgian auto IC specialist, has developed a new inductive sensing IC intrinsically immune to stray magnetic fields.
This article was posted on Dec 30, 2021