SiPho process has integrated III-V lasers
Tower Semiconductor and Juniper Networks have developed a silicon photonics (SiPho) foundry-ready process with integrated III-V lasers, amplifiers modulators and detectors.
This article was posted on Jan 4, 2022TrekApp tool tests stress in SoC and processor designs
Verification and stimulus specialist, Breker Verification Systems, has taken its Cache Coherency TrekApp as the basis for the System Coherency Synthesis TrekApp, which it introduced at DAC58 in San Francisco. The tool uses abstract models of common and novel algorithms to automatically generate high coverage coherency tests for complex, multi-agent system platforms based on coverage directives. The TrekApp can be configured for Arm, RISC-V and other processor configurations, together with a range of storage and I/O architectures.
This article was posted on Jan 4, 2022Edge inference accelerator has an eye on Megapixel vision systems
An edge inference accelerator developed by Flexlogix has a 4k MAC dynamic tensor processor array and is optimised for Mpixel image processing models in medical, surveillance and IoT applications.
This article was posted on Jan 4, 2022Compact AC/DC converter ICs
ROHM has developed AC/DC fly-back converter ICs with an integrated 730V breakdown MOSFET: the BM2P06xMF-Z series (BM2P060MF-Z, BM2P061MF-Z, and BM2P063MF-Z).
This article was posted on Jan 4, 2022Hitachi launches e-beam inspection system for EUV 3nm and 5nm processes
Hitachi High-Tech Corporation today announced the Development of its Electron Beam Area Inspection System.
This article was posted on Jan 4, 2022eGaN chipset shrinks size for high power density design
The ePower chipset family of 100V, 65A IC chipsets integrate a 100V EPC23101 eGaN driver and EPC2302 eGaN FET. Developed by Efficient Power Conversion (EPC), they reduce the solution size for high power density applications, including 48V DC-DC conversion in computing and brushless DC (BLDC) motor drives for e-mobility, robotics and drones.
This article was posted on Dec 30, 2021High energy density capacitors are up to 90% lighter than ceramics
Miniature micro-layer (MML) film capacitors offer energy density of 400j/dm3 for weight and size reductions compared to polypropylene or polyester dielectrics. The capacitors developed by Exxelia are available from New Yorker Electronics.
This article was posted on Dec 30, 2021Ageing experiment goes into space
Tomorrow, a government-backed experiment into ageing is set to launch to the International Space Station.
This article was posted on Dec 30, 2021EiceDRIVER family to enhance GaN SG HEMTs
Infineon is shipping the EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver ICs family.
This article was posted on Dec 30, 2021Inductive sensing IC immune to stray magnetic fields
Melexis, the Belgian auto IC specialist, has developed a new inductive sensing IC intrinsically immune to stray magnetic fields.
This article was posted on Dec 30, 2021ST adds to GaN power portfolio
ST has launched a family of GaN power semiconductors in the STPOWER portfolio.
This article was posted on Dec 30, 2021AFRL selects academic winners for Space University Research Initiative
The US Air Force Research Laboratory (AFRL) has announced the winners of its Space University Research Initiative (SURI) funding programme.
This article was posted on Dec 30, 2021TSMC introduces N4X process for HPC
TSMC has introduced its N4X technology – a 5nm process for HPC chips.
This article was posted on Dec 30, 2021Space Forge raises £7.7m
Space Forge of Cardiff, the returnable satellite startup, has raised £7.7 million in a funding round which was 4x oversubscribed.
This article was posted on Dec 30, 202117 IC companies have $10bn+ revenues
17 semiconductor companies are forecast to have sales of $10 billion or more this year, says IC Insights.
This article was posted on Dec 30, 2021Europrocessor gets another €17.5m
€15 million in equity investments from the European Commission EIC Accelerator program.
This article was posted on Dec 29, 2021eFPGA soft IP provides options for SoC and ASIC designs
At DAC, French embedded FPGA (eFPGA) supplier, Menta, introduced what it claims is the first eFPGA soft IP.
This article was posted on Dec 29, 2021Embedded World 2022 is postponed until June
Next year’s Embedded World will take place four months later than usual, as uncertainty due to the Covid-19 pandemic continues. Organiser, NürnbergMesse announced that the show will take place in Nuremberg from 21-23 June instead of its usual February timeslot.Benedikt Weyerer, the exhibition and conference’s executive director, said: “By deciding at an early stage to defer embedded world 2022 until summer, we are meeting the wishes of many exhibitors and enabling them to plan with confidence”.
This article was posted on Dec 29, 2021Mouser adds Siretta’s IoT portfolio with worldwide deal
IoT mobile broadband technologies from Siretta are now available from Mouser Electronics, following a worldwide distribution deal.
This article was posted on Dec 29, 2021Scalable LXI module provides flexibility up to 300×4 connections
Pickering Interfaces of Clacton-on-Sea has launched the 65-218 50×4, 1-pole LXI matrix plug-in module.
This article was posted on Dec 29, 2021Renesas shipping low jitter 400/800Gps timing devices
Renesas is shipping multi-channel timing devices for 400/800Gbps optical transport and wireline network applications with phase jitter as low as 88fs-rms.
This article was posted on Dec 29, 2021