UK made: VPX video frame grabber and streamer
Advanced Micro Peripherals of Cambridge has released two 3U video boards for VPX backplanes.
This article was posted on Jun 28, 2021A better PEEK
Glasgow University researchers have used 3D printing to add new properties to polyether ether ketone (PEEK) which result in lightweight, impact-resistant plastic-based ‘honeycomb’ structures which can sense when they have been damaged.
This article was posted on Jun 28, 2021512Mb NOR flash supports 166MHz SPI clocks.
Winbond has added to its SPI NOR Flash portfolio with a monolithic 1.8V 512Mb SPI NOR flash that can support up to 166 MHz standard/dual/quad SPI clocks.
This article was posted on Jun 28, 2021Digi-Key launches myLists consolidated list management system
Digi-Key Electronics has launched a way – dubbed myLists – to make it easier for customers to manage their component sourcing lists in one place.
This article was posted on Jun 28, 2021Imaging and sensing component market on 14.5% CAGR 2020-26
The global 3D imaging and sensing market is expected to grow to $15 billion in 2026, with a 14.5% CAGR 2020-2026, says Yole Developpement.
This article was posted on Jun 28, 2021624m 5G phones to be sold in 2021
624 million 5G smartphones will be sold this year up from 269 million in 2020, says Strategy Analytics.
This article was posted on Jun 28, 2021Intel and Qualcomm looking to combine strengths
Intel CEO Pat Gelsinger (pictured left) and Qualcomm CEO-elect Cristiano Amon (pictured right) are looking at areas of co-operation as compute and comms converge.
This article was posted on Jun 28, 2021Intel and Cellwize hook up for vRAN
Cellwize Wireless Technologies (Cellwize) will enable its CHIME technology on Intel Xeon Scalable processors with built-in AI acceleration and Intel FlexRAN reference software in order to propel deployment of automated AI-driven 5G vRAN networks.
This article was posted on Jun 28, 202110% growth for telecoms equipment market this year
The telecom equipment market grew 15% in Q1 y-o-y, says analyst Dell’Oro Group.
This article was posted on Jun 24, 2021Imec demoes integrated forksheet FETs for 2nm processes
Imec has demonstrated for the first time fully functional integrated forksheet FETs, with short-channel control (SSSAT=66-68mV/dec) comparable to GAA nanosheet devices down to 22nm gate length.
This article was posted on Jun 24, 2021Memory in a good place
Combined DRAM and NAND revenue in 2020 was US$122 billion, up 15% from 2019, says Yole Developpement.
This article was posted on Jun 24, 2021Vodafone goes for 5G Standalone
Vodafone is partnering with Ericsson to deploy a cloud-native dual-mode core for its 5G Standalone network where where all products and solutions are designed to run independently from previous generations of network equipment and technology.
This article was posted on Jun 24, 2021Nexperia to invest $700m
Nexperia is to invest $700 million over the next 12-15 months at its European wafer fabs, assembly factories in Asia and global R&D sites.
This article was posted on Jun 24, 2021PIC32MZ added to interchangeable MCU development boards
MikroElektronika, has introduced a SiBrain interchangeable board MCU board for Microchip’s PIC32MZ1024EFF144 microcontroller, giving access to its 144 pins, 1Mbyte flash memory and 262kbyte of ram.
This article was posted on Jun 24, 2021UK made: 1U modular RF distribution chassis for satcomms
ETL has introduced a 1U version of its Genus-brand modular RF distribution chassis for ground-segment satcomms, adding to its 2U, 3U and 4U version.
This article was posted on Jun 24, 2021OpenRoaming to bridge gap between cellular and WiFi
The Wireless Broadband Alliance (WBA) today announced the launch of WBA OpenRoaming Release 2, which enables network and service providers, including MNOs, Cable Operators and ISPs to offer enhanced services.
This article was posted on Jun 24, 20211.7kV SiC ac-dc converter ICs now in surface mount
Rohm has introduced surface-mount versions of its ac-dc converter ICs that include a 1,700V silicon carbide mosfet – opting for the 10.2 x 4.4 x 15.5mm TO 263-7L package, which can be automatically mounted in production.
This article was posted on Jun 24, 2021Fusion demo plant to be built at Culham
Today, UKAEA and General Fusion of Canada have announced an agreement under which General Fusion will build and operate its Fusion Demonstration Plant (FDP) at UKAEA’s Culham Campus.
This article was posted on Jun 24, 2021Menlo Micro and X-Microwave deliver RF prototyping block
Menlo Micro has partnered with X-Microwave to deliver an X-MWblocks modular building block that enables developers to rapidly prototype RF systems based on Menlo Micro’s MM5130 switch.
This article was posted on Jun 23, 2021Cohere Technologies and VMWare combine on O-RAN
VMware’s RAN Intelligent Controller (RIC) Platform
This article was posted on Jun 23, 2021Government in talks with six EV battery makers
The government is in talks with Samsung, Ford, Nissan, LG, Britishvolt and InoBat Auto about setting up factories to make EV batteries, reports the FT.
This article was posted on Jun 23, 2021