Intel’s German fab subsidy to be upped to €9.9bn
On Monday, Intel is expected to announce that its subsidy from the German government for its Magdeburg fab-site will be increased, reports Handelsblatt.
This article was posted on Jun 26, 2023Intel to build $4.6bn assembly and test plant in Poland
Intel is to build a $4.6 billion assembly and test plant in Poland.
This article was posted on Jun 26, 2023Bulk acoustic wave RF filter foundry spans 1.6GHz to 7GHz, with plans for 20GHz
Akoustis Technologies, a maker of RF bulk acoustic wave (BAW) filters, has launched foundry service making filters for wireless markets including phones, Wi-Fi, military, 5G infrastructure and automotive.
This article was posted on Jun 26, 2023EBV Elektronik signs franchise deal with Nisshinbo
Distributor EBV Elektronik has signed a franchise agreement with analogue, power and microwave component maker Nisshinbo Micro Devices.
This article was posted on Jun 26, 2023Embedded Studio stops overflowing Arm stacks
Segger has added a way to prevent stack overflows to its Embedded Studio for Arm IDE (integrated development environment).
This article was posted on Jun 26, 2023Gadget Book: Connecting to the Internet with Raspberry Pi Pico W
Yesterday I was writing about Bluetooth coming to the Raspberry Pi Pico W and – in the original Raspberry Pi post – I also saw a link to this e-book: Connecting to the Internet with Raspberry Pi Pico W. Very interesting it looks, too.
This article was posted on Jun 26, 2023Datacentre capex to fall 8%
2023 datacentre capex will fall 8% y-o-y with softness in the enterprise IT and hyperscaler markets, says Dell’Oro.
This article was posted on Jun 26, 2023Durham measures optical turbulence in atmosphere for FSO comms networks
Durham University is working with Viasat to better understand atmospheric turbulence in free-space optical (FSO) communications.
This article was posted on Jun 26, 2023Enterprise WLAN on a roll; consumer WLAN declining
In Q1 the enterprise segment of the WLAN market increased 43.3% y-o-y to reach $2.8 billion, says IDC.
This article was posted on Jun 26, 2023Elektra deadline: Under one month left for Elektra Awards 2023 entries
Entrants for the Elektra Awards 2023, which are organised by Electronics Weekly, are encouraged to complete their entries with under one month to go before the official deadline.
This article was posted on Jun 21, 2023Advanced Packaging market has 10.6% CAGR to hit $79bn in 2028
The Advanced Packaging market, valued at $44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022 to 2028, reaching $78.6 billion in 2028, reports Yole Developpement.
This article was posted on Jun 21, 2023Imec and ATS integrate D-Band chips and waveguides into cheap PCBs
Imec and AT&S – the PCB and IC substrate manufacturer – have made a major step towards realising a novel system integration approach, whereby D-Band chips and waveguides are integrated into low-cost, mass-manufacturable PCBs.
This article was posted on Jun 21, 2023PCI-SIG Conference: PCIe 3.0 packet switches, qualified for automotive systems
Diodes has created a series of automotive-compliant PCI Express 3.0 packet switches for in-vehicle networking.
This article was posted on Jun 21, 2023Sponsored Content: A new way to solve systematic circuit failures and boost yield
A novel approach from Siemens and PDF Solutions improves yield ramp on advanced nodes and solves yield limiters through volume manufacturing.
This article was posted on Jun 21, 2023Intel in cooler chips project
The U.S. Department of Energy (DOE) has announced its selection of Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers.
This article was posted on Jun 21, 2023Smiths adds EMI screening to connector for satellites
Smiths Interconnect has created an EMI flange for its high-speed NXS connectors, intended for use in satellites.
This article was posted on Jun 21, 2023Voda3 is a poser for CMA
The long-trailed merger between Vodafone and 3 was announced this morning, posing a thorny regulatory issue for the Competition and Markets Authority (CMA) the competition regulator.
This article was posted on Jun 21, 2023Sulphur co-polymers offer low-cost thermal imaging lenses
Step aside precision-ground solid germanium, as Flinders University has discovered an injection-mouldable plastic that can be used for the lenses of thermal imaging cameras.
This article was posted on Jun 21, 2023Tiny photo relays from Toshiba are 2mm long
Toshiba has introduced a photo-relay in a 1.45 x 2mm package that switches on in 250μs – 50% quicker than its existing TLP3475S.
This article was posted on Jun 21, 2023IMS: Flexible EMI shielding films can be hot-pressed onto PCBs
Toyochem has created a series of flexible conductive and insulating sheet films for the protection of electrical and electronic equipment, including EMC protection.
This article was posted on Jun 19, 2023VLSI Symposium: Imec’s low-power UWB transceiver ranges to 1.4mm
Belgian lab Imec is claiming record ranging precision and power consumption for a novel 6 – 9GHz IEEE 802.15.4z UWB (ultra-wide-band) impulse-radio transceiver: 1.4mm ranging, and 8.7mW Tx plus 21mW Rx consumption in continuous mode.
This article was posted on Jun 19, 2023