Tokyo Institute of Technology has created a Sub-THz 6G transceiver, which will be revealed next week at the VLSI Symposium.
This article was posted on Jun 19, 2023STEM education projects, and support for international science partnerships, will receive a £6.6 million funding boost, the UK Space Agency (UKSA) has announced.
This article was posted on Jun 19, 2023Q1 production of smartphones was 250 million units – a 19.5% YoY decrease, which represents not only the greatest YoY annual decrease but also the lowest quarterly production since 2014, says TrendForce.
This article was posted on Jun 19, 2023The market value of all power converters for xEV vehicles will reach $29 billion in 2028, with a 12.2% CAGR between 2022 and 2028, says Yole Developpement, thanks to constant cost reduction measures.
This article was posted on Jun 19, 2023Intel may not be building a fab complex in Germany after it asked for higher subsidies from the German government.
This article was posted on Jun 19, 2023A 28-year veteran of the Korean chip industry with stints at Samsung and Hynix has been arrested and indicted for a failed attempt to set up a copycat Samsung fab a mile away from a genuine Samsung fan in Xian, China.
This article was posted on Jun 19, 2023Microchip has announced a cesium atomic clock that can keep time for months in the event of GNSS denials, according to to the company.
This article was posted on Jun 19, 2023GITAI, the Japanese and US space robotics startup, has highlighted the successful demonstration of its Lunar Manipulator and Rover in a simulated regolith chamber.
This article was posted on Jun 19, 2023AsiaRF has introduced a Wi-Fi CERTIFIED HaLow IoT gateway, powered by Morse Micro’s MM6108 Wi-Fi HaLow SoC.
This article was posted on Jun 14, 2023April IC sales were $40 billion, says the SIA, up 0.3% m-o-m and down 21.6% y-o-y.
This article was posted on Jun 14, 2023Ergonomic, precision and versatile solutions for demanding users.
This article was posted on Jun 14, 2023ST and Sanan Optoelectronics of China have are to create a 200mm SiC device manufacturing JV in Chongqing, China.
This article was posted on Jun 14, 2023AMD will continue to supply Spartan 6 FPGAs until at least 2030, the company announced.
This article was posted on Jun 14, 2023Chomerics has unveiled a thermal interface gel aimed at high-throughput production.
This article was posted on Jun 14, 2023iWave has added an NXP i.MX 91 option to its iW-RainboW-G50M family of OSM v1.1 solderable LGA system-on-modules.
This article was posted on Jun 14, 2023Graphene-like foam sensors from Stirlingshire-based Integrated Graphene can detect lactate concentrations for medical and fitness applications, according to research at the University of Bath.
This article was posted on Jun 14, 2023Farnell and HIOKI have teamed up to offer a limited-time special offer for the HIOKI BT3554 battery tester series in Europe.
This article was posted on Jun 14, 2023The latest addition to the UK’s Satellite Applications Catapult’s network of Space Enterprise Labs has opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
This article was posted on Jun 14, 2023IBM has announced a European quantum computer data centre at its facility in Ehningen, for companies, research institutions and government agencies.
This article was posted on Jun 13, 2023Tokyo Institute of Technology scientist have discovered a promising proton conductor for protonic ceramic fuel cells.
This article was posted on Jun 13, 2023Today Japan has come out with its semiconductor strategy which sees the country tripling its chip sales to $108 billion by 2030.
This article was posted on Jun 13, 2023