Electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices, say CEA-Leti researchers.
This article was posted on Jun 12, 2023The initial subsystem includes all the analog IP required for a typical battery powered IoT system, including a power management unit (PMU), a sleep management unit (SMU), and data converters.
This article was posted on Jun 12, 2023Renesas Electronics has teamed up with electric motor maker Nidec to develop a 6-in-1 e-axle for electric vehicles.
This article was posted on Jun 12, 2023Faced with an empty driving seat, pedestrians trust certain visual prompts when deciding whether to cross in front of an autonomous car, according to the University of Nottingham, which has studied such behaviour on its own campus.
This article was posted on Jun 12, 2023MBA Polymers UK has launched a recycled ABS (acrylonitrile butadiene styrene) feedstock for injection moulding in electronics, automotive and consumer industries.
This article was posted on Jun 12, 2023Backside power delivery, which Intel calls PowerVia, is going to be a big factor in the company’s 20A node due in 2024.
This article was posted on Jun 12, 2023GlobalFoundries and ST have completed the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.
This article was posted on Jun 12, 2023Satellite Vu has raised a further £12.7m in Series A-2 funding, bringing its investment total to £30.5m.
This article was posted on Jun 12, 2023Satellite Vu has raised a further £12.7m in Series A-2 funding, bringing its investment total to £30.5m.
This article was posted on Jun 12, 2023Q1 shipments of AR and VR headsets fell 54.4% y-o-y with VR representing 96.2% of the VR/AR headsets shipped, according to (IDC) Worldwide Quarterly Augmented and Virtual Reality Headset Tracker.
This article was posted on Jun 12, 2023Iceye, the Finnish satellite imagery specialist, has introduced a new imaging mode, dubbed “Dwell”, for its synthetic-aperture radar (SAR) small satellites.
This article was posted on Jun 9, 2023Siemens Digital Industries Software and OSAT specialist Siliconware Precision Industries (SPIL) have implemented an IC package assembly planning and 3D layout vs. schematic (LVS) assembly verification workflow for SPIL’s fan-out family of advanced IC packaging technologies.
This article was posted on Jun 9, 2023Vitesco Technologies and onsemi have signed a long-term supply agreement for SiC products.
This article was posted on Jun 9, 2023It is a market like no other – massive surpluses in some product lines, shortages, allocations and long lead-times in others.
This article was posted on Jun 9, 2023Raspberry Pi is on the way to consistent shipments of a million units a month.
This article was posted on Jun 9, 2023Nexperia has created an energy harvesting IC for photovoltaic cells up to around 1mW, that automatically matches the cell to the battery – aiming to extract at least 80% of energy that the cell can produce for any given illumination. Harvesting range is 35µW to 2mW.
This article was posted on Jun 9, 2023Electronics manufacturing SMEs from the Northern Powerhouse region have gathered in Leeds to boost their exports to Australia, supported by Lord Botham, formerly cricketer Ian Botham, the UK Government’s trade envoy to Australia.
This article was posted on Jun 9, 2023The UK government has announced £50 million of funding – the Space Clusters and Infrastructure Fund (SCIF) – to support research and development with a focus on building the UK’s space infrastructure.
This article was posted on Jun 9, 2023Rohm is aiming at motor drives operating on 24, 36 or 48V with n-channel mosfets rated at 40, 60, 100 or 150V to give some leeway for spikes and noise.
This article was posted on Jun 8, 2023CUI has three new micromachined omnidirectional microphones for portable devices and wearables, that can work across 20 to 20,000 Hz.
This article was posted on Jun 8, 2023Kioxia is sampling UFS Ver. 4.0 embedded flash memories which integrate BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package.
This article was posted on Jun 8, 2023