Shhh… gearboxes are quiet for NEMA 17 motors
Nanotec has created low-noise planetary gearboxes for brushless DC and stepper motors with NEMA 17 flanges (42mm, 1.7in).
This article was posted on Apr 23, 20233 axis automotive gyro and accelerometer for ASIL B driving
STMicroelectronics has introduced automotive-qualified MEMS six-axis inertial-sensing module.
This article was posted on Apr 23, 2023EdgeQ raises $75m
Today EdgeQ completed a $75 million Series B funding round.
This article was posted on Apr 23, 2023Pickering adds to battery simulator modules
Pickering Interfaces of Clacton-on-sea has announced the latest version in its 41/43-752A range of battery simulator modules.
This article was posted on Apr 23, 2023Slingshot expands Global Sensor Network for better LEO space tracking
Slingshot Aerospace, a space tracking and analytics company, is expanding its Global Sensor Network’s low-Earth orbit (LEO) tracking capabilities.
This article was posted on Apr 23, 2023Swiss space debris startup sees ClearSpace in United States
ClearSpace, the space debris removal startup founded in Switzerland, is expanding to the United States.
This article was posted on Apr 20, 2023Electronics production in decline
Electronics production is in decline, says Semiconductor Intelligence.
This article was posted on Apr 20, 2023Fewer memories from China
China’s memory production is expected to decline over the next two years.
This article was posted on Apr 20, 2023Automotive interior lighting association tops 50 members
Five more members have joined the likes of NXP, Microchip and Renesas in the ISELED Alliance, which overlooks a system of multi-colour addressable automotive LED tape lighting, built around ICs from Inova Semiconductors.
This article was posted on Apr 20, 2023RDS adds multi-colour e-Paper displays
Review Display Systems is stocking monochrome and multi-colour e-Paper dot matrix displays from Holitech Technology.
This article was posted on Apr 20, 2023TI adds to WiFi ICs for IoT
TI today introduced a new SimpleLink family of Wi-Fi 6 companion ICs to help designers implement Wi-Fi connections at an affordable price for applications that operate in high-density or high-temperature environments up to 105ºC.
This article was posted on Apr 20, 202312V automotive load switches for ISO26262 functional safety
Infineon has introduced automotive high-side power switches for safety-critical circuits.
This article was posted on Apr 20, 2023Asahi Kasei developing fast response current sensing tech
Asahi Kasei Microdevices (AKM) is developing a new ultra-fast response current sensing technology.
This article was posted on Apr 20, 2023Apple Electronic Engineering Academy hosts female electronics engineers
As well as partnering with the UK Electronics Skills Foundation (UKESF) for the Girls Into Electronics 2023 initiative, Apple has been holding its Electronic Engineering Academy, a two-day event for young women between the ages of 16-18.
This article was posted on Apr 20, 2023The future technology of datacentres
The technological evolution of the datacentre has been addressed by Imec’s Joris Van Campenhout.
This article was posted on Apr 20, 2023Smart capsule monitors dose for radiotherapy
For monitoring X-ray does in patients undergoing radiotherapy for gastrointestinal cancer, a group of researcher have created a prototype swallowable dosimeter capsule that also measures gut pH and temperature.
This article was posted on Apr 19, 2023Don’t throw this battery away, eat it
Researchers at the Istituto Italiano di Tecnologia (IIT) have made an edible rechargeable battery from things already eaten by humans.
This article was posted on Apr 19, 2023Semtech adds to PerSe proximity sensors
Semtech has expanded its PerSe product portfolio with the release of a sensing human proximity sensor for smartphones.
This article was posted on Apr 19, 2023Blue Canyon to provide microsatellites for JPL’s INCUS Mission
NASA’s Jet Propulsion Laboratory (JPL) has awarded a contract to Blue Canyon Technologies (BCT) to design and manufacture three satellites for the Investigation of Convective Updrafts (INCUS) mission.
This article was posted on Apr 19, 2023US Chips Act gets 200+ Statements of Interest
Since releasing the first CHIPS for America funding opportunity in February 2023, the Department of Commerce’s CHIPS Program Office has received more than 200 Statements of Interest (SOIs) from potential applicants.
This article was posted on Apr 19, 2023Arm could be on the hook for $8.5bn of Softbank debt
If Arm does not file for its public offer by the end of September it could become liable for $8.5 billion of Softbank debt for which it was made a guarantor.
This article was posted on Apr 19, 2023